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Cutting Fluids

Cutting fluids are liquids used during the process of wafer dicing and other similar cutting processes in the semiconductor industry. These fluids help to reduce friction, minimize thermal damage, improve tool life, and prevent damage to the wafer surface. Some common types of cutting fluids used in the semiconductor industry include water-soluble coolants, oil-based coolants, semi-synthetic coolants, and synthetic coolants. Different cutting fluids may be chosen based on the type of material being cut, the cutting process, and other specific requirements, such as environmental considerations.Cutting fluids play a crucial role in wafer slicing and dicing processes in the semiconductor industry. These fluids are used to cool and lubricate the cutting blade and substrate, reduce friction, and prevent defects in the wafer edge. They also help to prolong the life of the blade, reduce wear, and provide a cleaner working environment. There are two main types of cutting fluids used in wafer slicing and dicing: oil-based and water-based. Oil-based cutting fluids are mineral oils that are used to reduce friction, heat and provide lubrication. They are typically used in slicing processes, as they provide good lubrication and cooling properties. However, they can also be messy and generate fumes that are harmful to workers. Water-based cutting fluids, on the other hand, are made of deionized water and emulsifiers that help to reduce friction and heat. They are widely used in dicing processes, as they are environmentally friendly and do not generate fumes. They are also non-toxic, making them safer for workers. Additionally, water-based cutting fluids have excellent cooling properties, making them ideal for high-speed dicing. The choice of cutting fluid depends on the specific requirements of the slicing or dicing process. For example, if the goal is to minimize blade wear, an oil-based fluid may be used. If the goal is to reduce friction and heat, a water-based fluid may be used. When using cutting fluids, it is important to follow the manufacturer's instructions carefully. This includes proper storage, handling, and disposal of the fluids, as well as the correct dilution ratios. It is also important to regularly monitor the fluid's condition to ensure that it is working effectively. In conclusion, cutting fluids play a critical role in wafer slicing and dicing processes in the semiconductor industry. They help to reduce friction, heat and prevent defects in the wafer edge, prolong the life of the blade, and provide a cleaner working environment. The choice of cutting fluid depends on the specific requirements of the process, and it is important to follow the manufacturer's instructions carefully to ensure safe and effective use. There are several brands that offer cutting fluids for wafer dicing. Some of the well-known brands include: Fujimi Incorporated Chemetall Endura Brulin Blaser Swisslube Houghton International Cool-Grind Technologies

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Noritake Co., Limited

, JP Manufacturer

Grinding and polishing tools, coolants, electronic pastes for thick film technology, thick film substrates.

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Suzhou Runde New Material Co., LTD.

, CN Manufacturer

Wire saw cutting auxiliary materials- adhesives, coolants, beams.

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Ohtomo-chemical ins.,corp

, JP Manufacturer

Ohtomo-chemical produces different types of coolant, cleaning agents, removing agents, and other products.

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Youngchang Chemical Co Ltd, YCCHEM

, KR Manufacturer

chemical materials such as PHOTORESIST, HT-SOC, SLURRIES, RINSING SOLUTIONS, ETCHANT, and STRIPPERS and supplies them to the semiconductor, display, and eco-friendly industries.

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Zhengzhou Research Institute for Abrasives & Grinding Co., Ltd

, CN Manufacturer

Diamond blades, diamond cutting and grooving wheels, ultra-thin diamond blades. Diamond & CBN grinding wheels, diamond & CBN honing stones and sticks. Diamond slurries. Precision ceramic parts.

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Keteca USA, Inc.

, US Manufacturer

Semiconductor Dicing Solutions, Dispensers, and Blades

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Chemetall Precision Microchemicals

, US Manufacturer

Precision engineered fluids for the sawing, dicing, grinding, lapping, polishing, and cleaning of a wide spectrum of materials used in many high-end technology.

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UDM Systems, LLC

, US Manufacturer

Wafer Dicing & Surface Cleaning Solutions for Semiconductor, Solar & Biomedical

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