Packaging Equipment

Air Cavity Near Hermetic Semiconductor Packaging. Air Cavity Plastic Packages, B-Stage Components, Sealing Equipment ​

Thick Film and SMD (Surface Mounting Device), IMS, screen-printing on stainless steel technology, ensuring a full-service custom design.

Semiconductor Equipment Solutions. Wet Bench Process Equipment, Single Wafer Wet Process Equipment, FOUP cleaner

AMB ceramic substrates. Research, design and prototype advanced packaging concepts. Low to medium package assembly and transfer to volume OSATs. Advanced transfer molding and sintering systems

LCD/OLED In-line Production System. Process equipment: 3D Lamination, Dispenser, Grinder, Bake Oven, Furnace Oven, Micro LED Dispenser.

Wet Station, Ultrasonic Cleaner, Tube Cleaner and Parts Cleaner for semiconductor and FPD production parts cleaning equipment. Chemical Supply System

Laser processing equipment for semiconductor, display, PCB

LED/OLED Equipment: Wireless logistics, Micro LED Chip AOI Inspector, Dispenser, PAD Cleaner, COG FOG AOI. Semiconductor: Mount Inspector, Wire Bonding, Die Attach, Wafer Warpage, WRS Inspector, STOCKER system, Wafer Edge, Macro Tower Lifter, STB, Rail.

Central Chemical Supply System / Wet System / Inkjet Printing System for semiconductor and display

Wafer Transfer Robots, FOUP Handling Robot, Reticle / Mask Handling Robot, Load Port / Loader, Aligners, EFEM (Equipment Front End Module)

ICP ETCHER, DRIE ETCHER, CCP ETCHER, LED ETCHER, NANO-IMPRINTER

FPD equipment: Edge Grinder, Edge Profiler, Drilling Machine, Cover Glass Grinder, Mother Glass Grinder. OLED Inspection, Edge Inspection, Various AOI Inspection Equipment. Laser processing equipment. Semiconductor: Loader＆Unloader, FOUP Packing Machine.

Nanoimprint lithography (NIL) tools, resists, masks, and processes for a variety of NIL including thermal and photo-curable NIL, as well as direct imprinting of materials.

Manufacture Furnaces. Refurbishment and relocation of diffusion furnaces and RTP equipment. Spare parts

Wafer box, wafer carrier, wafer cassette, wafer carrier handle, RSP (reticle SMIF pod), RSP opener, mask case, chip tray, fluoro valves, cleanroom supplies, wafer and cassette cleaning systems

Semiconductor vacuum equipment and parts. Alignment, Bonding, Annealing, LC Filling, Vacuum Sealing Equipment. Glove box/ Gas purification equipment. Fluxless reflow equipment/ Reduction bonding equipment.

Maskless lithography system for 2D and 2.5D digital manufacturing

Dispenser, Vision Dispenser, Cabinet Vision Dispenser, Piezo Jet Valve, Wafer Reinforcement, ASIC Encapsulation, Solder Paste, Wafer Underfill, Smart Production Line, Micro Spot Soldering, Soldering Machine

Mass production projection exposure system, CVS equipment QUALILAB ELITE, AXP2.0-DFP2, UV-LED optics for aligner/cure, UV exposure irradiation unit