R&D and manufacturing of semiconductor front-end process equipment.
SINO-Plasma 1000 Glue Remover
Machine introduction
SINO-Plasma 1000 is a multi-cavity glue removal equipment independently developed by Evan Technology. It adopts an open transfer platform, an inductively coupled plasma (ICP) source and a dual-wafer reaction chamber design. It is equipped with a high-precision transfer arm and is based on Windows. The man-machine exchange interface of the platform is easy to operate and the system architecture is reasonable. The equipment has the advantages of small footprint, high production efficiency, low cost of consumables (COC) and operating cost (COO). It is suitable for the removal of various photoresists in the front and rear sections of the semiconductor.
Application areas
· 6-inch to 8-inch silicon-based semiconductor production lines
· 4-inch to 6-inch silicon carbide, gallium nitride, gallium arsenide and other production lines for glue removal applications
· packaging and testing, MEMS and other application
product advantages
· dual cavity dual wafer The reaction chamber has high productivity and efficiency
. High-density plasma and high glue removal rate
. Using Faraday complete ion shielding, low plasma damage to wafer surface devices. Low
consumption and maintenance costs of reaction chamber process kits
. Suitable for various conditions of removal
Main technical parameters of glue application
Equipment Availability / Uptime: ≥92
WPH: >140
Strip Rate: >6,0000 A/min
Strip Rate Uniformity: <5%
Substrate Loss: <15A
SINO-Plasma 100 Glue Remover
Machine introduction The
SINO-Plasma 100 glue removal machine is a single-chamber glue removal equipment independently developed by Yiwen, equipped with a high-precision transfer arm, an inductively coupled plasma (ICP) source, and a high-precision temperature control hot plate module. The operating system is independently developed based on the Windows platform, the large-inch LCD touch panel, and the man-machine interface is simple and convenient. The equipment has the advantages of small footprint, low consumables and low operating costs. It is suitable for the removal of various photoresists in the front and rear sections of the semiconductor.
Application
3.4 inch to 8 inches silicon semiconductor production line
3.4 inches to 6 inches silicon carbide, gallium nitride, gallium arsenide, and other production lines of glue applied to the
-package test, the MEMS applications
Advantages
High precision delivery platform
· high etch rate
-professional program design, and each position interlock protection products
big foot inch touch screen human-machine interface exchange, visualization
· reaction chamber suite loss and low maintenance costs
* may provide a variety of new technology development and solutions
main Technical parameters
Equipment Availability / Uptime: ≥92
WPH: >30
Strip Rate: >6,0000 A/min
Strip Rate Uniformity: <5%
Substrate Loss: <15A
SINO Plasma 2000 CVD
Machine introduction
SINO-Plasma 2000 is a multi-cavity CVD equipment independently developed by Evantech. It can be configured with up to 3 cavities. It adopts an open transfer platform and a dual wafer reaction chamber design, and is equipped with a high-precision transfer arm. It is based on the Windows platform. The man-machine exchange interface is easy to operate and the system architecture is reasonable. The equipment has the advantages of small footprint, high production efficiency, low cost of consumables (COC) and operating cost (COO). Compatible with various CVD processes of gas and liquid sources.
Application areas
· 6 inch ~ 8 inch silicon-based semiconductor production line
· 4 inch ~ 6 inch silicon carbide, gallium nitride, gallium arsenide and other production lines of CVD application
product advantages
· Configuration of 3 dual-wafer reaction chambers, high productivity and efficiency
· High-density plasma, high
compatibilitywith various processes· Compatible with PETEOS, PESIN, BPSG and other processes
· Low consumption and maintenance cost of reaction chamber process kit
· Compatible with low temperature process capability
Main technical parameters
Equipment Availability / Uptime: ≥92
Deposition rate : Customize
Deposition uniformityaccording to different processes:<1. 5% (1 sigma)
Heater Temperature Control: ±2°C of setpoint
SINO Plasma 200 UV curing machine
Machine introduction
SINO-Plasma 200 UV curing glue machine is a single cavity UV curing glue equipment independently developed by Yiwen, equipped with high-precision transfer arm and high-precision temperature control hot plate module. The operating system is independently developed based on the Windows platform, the large-inch LCD touch panel, and the man-machine interface is simple and convenient. The equipment has the advantages of small footprint, low consumables and low operating costs. It is suitable for various UV curing processes of semiconductors.
Application areas
· 4 inch ~ 8 inch silicon-based semiconductor production line
· 4 inch ~ 6 inch silicon carbide, gallium nitride, gallium arsenide and other production lines of UV solid glue application
product advantages
· high-precision transmission platform
· good programming design, each Position interlocking and product protection
· Large-inch touch screen man-machine exchange interface, visual operation
· Accurate temperature control
· Reaction chamber kit loss and low maintenance cost
· Provide a variety of new process development and solutions
Main technical parameters
Equipment Availability / Uptime ：≥95
WPH:>80
Heater Temperature Control: ±2°C of setpoint
Irradiation intensity: 275+-45 MW/ CM2, 105+-30 MW /CM²
SINO-ALD P200
Machine introduction The
atomic layer deposition system SINO-ALD P200 is a mass production type atomic layer deposition equipment independently developed by Yiwen. It adopts a cavity structure and air intake method to effectively reduce production costs and increase yields, ensuring good film performance. Suitable for mass production of wafers of 200mm and below. Humanized software design, easy one-click operation.
Application areas
· Organic/inorganic light emitting diodes
· MEMS
· Power devices
·
Advantages of integrated circuit products
· Low precursor source consumption, short film growth cycle
· Compact integrated design, small footprint
· Stable temperature, high film uniformity
·Highapplication depth Aspect ratio material
· Optional preheating module to effectively reduce waiting time and increase productivity
· The product fully complies with SEMI S2/S8 and SECS/GEM standards.
Main technical parameters
Max. wafer size: 8'' (200mm)
Cassette: 25pcs
Non-uniformity : 1%
Max. Temp: 500℃
SINO-ALD C200/C300
PRODUCT INTRODUCTION
SINO-ALD C200/C300 is an integrated process platform independently developed by AMTE for large-scale production. Thermal type and plasma type process can be configured at the same system, it can be compatible with a variety of processes and detection equipment. Also, it’s equipped with high precision automatic vacuum robot. Suitable for mass production of semiconductor production lines such as integrated circuits, advanced packaging and power devices. Innovative interlock cluster design, easy interface operation.
APPLICATIONS
· 8-12 inch and under 8 inch semiconductor production line
· Scientific research or industrial production of oxide and nitride thin film process
ADVANTAGES
· High precision flexible vacuum robot
· Compatible with 200m / 300mm semiconductor production line
· 4 stations, can be configured with the same or different equipment
· Large scale production
· Perfect interlock cluster
TECHNICAL PARAMETERS
Wafer size: 200mm /300mm
Cassette: 25pcs
Loading/unloading mode: automatically
