F&K Physiktechnik GmbH is backed by more than 15 years of experience in the development and manufacturing of products and processes used worldwide for chip interconnection in microelectronic production. Mike Kölling
Building Potsdam Launched by founder Mike Kölling in 2002 F&K Physiktechnik was the result of many years of excellent cooperation between F&K Delvotec Bondtechnik GmbH in Ottobrunn and GaP in Teltow.
Our focus is primarily on ultrasonic technology. Customers around the globe are using F&K Physiktechnik's generators and transducers to realize their projects in ultrasonic wire and (flip chip) die bonding. In addition to this, we offer test and measurement equipment to characterize and set up ultrasonic systems of bond machines.
In order to set up the ultrasonic system of a bond machine in the best condition as possible we developed special test and measurement equipment. It can be used for service purposes as well as for quality assurance. All information about the condition of the ultrasonic system of the bond machine can be feed into a quality management system. By using the test and measurement equipment preventive maintenance will be also possible.
Supplementary to our ultrasonic measurement systems, F&K Physiktechnik manufactures a bi-directional alignment laser dedicated to adjust optical experiments easily.
F&K Physiktechnik recognizes itself as a system supplier for all users of ultrasonic bonding technology.
Product lineup:
Ultrasonic transducers
Ultrasonic generators
Transducer-test-systems
Optical displacement measurment systems
Bond force calibration systems
Alignment laser
Services:
Consulting for bond process development
Evaluation of bond behaviour
Vibration measurements at side (Laserinterferometer)
Research at vibration behaviour of components
Customized U/S-Generators (development)
Customized U/S-Transducer (development)
