DISCO Corporation

 , JP Manufacturer
Precision Machines: Dicing Saws, Laser Saws, Grinders, Polishers, Wafer Mounter, Die Separator, Surface Planer, WaterJet Saw. Precision Processing Tools: Dicing Blades, Grinding Wheels, Dry Polishing Wheels.

LINTEC Corporation Advanced Materials Operations

 Tokyo, JP Manufacturer
Manufacturer of adhesive tapes for backgrinding and dicing, laminators and other equipment.