DISCO Corporation
, JP Manufacturer
Precision Machines: Dicing Saws, Laser Saws, Grinders, Polishers, Wafer Mounter, Die Separator, Surface Planer, WaterJet Saw. Precision Processing Tools: Dicing Blades, Grinding Wheels, Dry Polishing Wheels.
Kinik Company
, TW Manufacturer
Abrasives, cutting tools and 8", 12" reclaimed wafers.