Daesung Metals Inc., Co

 , KR Manufacturer
Sputtering Targets, Gilding Materials, Conductive Pastes.

Bonotec Electronic Materials Co.Ltd.

 , CN Manufacturer
Packaging and bonding materials in the semiconductor and electronics field.

Research Institute of Electronic Materials, NIIEM

 , RU Manufacturer
Special polymer materials for electronics

Shenzhen Sinoguide Technology Co., Ltd

 , CN Custom Manufacturer
Thermal management products. Lead frames and other stamping and etching products.

Shanghai Beginor Polymer Materials Co Ltd

 , CN Manufacturer
Potting material, Jelly Gel, Sealant & Adhesive, Thermal Conductity, Conformal Coating, ALubrication Grease

ROARTIS bvba

 , BE Manufacturer
Electrically conductive adhesives, Thermally conductive adhesives, Thermal greases, Thermal Gap-fillers, Underfill, Glob top, Dam & Fill encapsulants, UV-curable adhesives, Potting resins.

ACI Materials

 , US Manufacturer
Electronic Adhesives, Inks, Pastes and Coatings

YINCAE ADVANCED MATERIALS, LLC

 , US Manufacturer
Underfill Materials, Die Attach Adhesives, Wafer Level Materials, Optoelectronic Materials, Conformal Coatings.

AOS Thermal Compounds LLC

 , US Manufacturer
Non-Silicone Thermal Grease, dry-to-the touch thermal grease pads, GAP material, High thermal conductivity, low thermal resistance.

EpoxySet, Inc.

 , US Manufacturer
Adhesives, potting and encapsulation products for semiconductors and electronics.

SEKISUI CHEMICAL CO., LTD.

 , JP Manufacturer
LCD fine particles, photosensitive materials, semiconductor materials, optical film, industrial tapes

Chaozhou Three-Circle Group Co Ltd, CCTC

 , CN Manufacturer
Cearmic packages for SAW, XTAL, OSC. Glass-to-metal seals. Ceramic wire bonding capillaries. AlN, Al2O3 substrates, nano zirconia powder.

Indium Corporation

 , US Manufacturer
Electroplating, fluxes, inorganic compounds, high purity metals, sintering pastes, solders, TIM, thin film materials.

Dow

 , US Manufacturer
Adhesives, solvents for semiconductors

Parker LORD

 , US Manufacturer
Die attach materials, encapsulation materials, underfills and gels, thermal greases.

NAMICS Corporation

 , JP Manufacturer
Die attach materials, underfill materials. Conductive, EMI shielding pastes. Thermally and electrically conductive and insulating films.

TANAKA HOLDINGS Co., Ltd

 , JP Manufacturer
Bonding wire. Precious metal materials for semiconductor industry: precursors for ALD/CVD, targets, die bonding adhesives and sealing materials.