Daesung Metals Inc., Co
, KR Manufacturer
Sputtering Targets, Gilding Materials, Conductive Pastes.
Bonotec Electronic Materials Co.Ltd.
, CN Manufacturer
Packaging and bonding materials in the semiconductor and electronics field.
Research Institute of Electronic Materials, NIIEM
, RU Manufacturer
Special polymer materials for electronics
Shenzhen Sinoguide Technology Co., Ltd
, CN Custom Manufacturer
Thermal management products. Lead frames and other stamping and etching products.
Shanghai Beginor Polymer Materials Co Ltd
, CN Manufacturer
Potting material, Jelly Gel, Sealant & Adhesive, Thermal Conductity, Conformal Coating, ALubrication Grease
ROARTIS bvba
, BE Manufacturer
Electrically conductive adhesives, Thermally conductive adhesives, Thermal greases, Thermal Gap-fillers, Underfill, Glob top, Dam & Fill encapsulants, UV-curable adhesives, Potting resins.
ACI Materials
, US Manufacturer
Electronic Adhesives, Inks, Pastes and Coatings
YINCAE ADVANCED MATERIALS, LLC
, US Manufacturer
Underfill Materials, Die Attach Adhesives, Wafer Level Materials, Optoelectronic Materials, Conformal Coatings.
AOS Thermal Compounds LLC
, US Manufacturer
Non-Silicone Thermal Grease, dry-to-the touch thermal grease pads, GAP material, High thermal conductivity, low thermal resistance.
EpoxySet, Inc.
, US Manufacturer
Adhesives, potting and encapsulation products for semiconductors and electronics.
SEKISUI CHEMICAL CO., LTD.
, JP Manufacturer
LCD fine particles, photosensitive materials, semiconductor materials, optical film, industrial tapes
Chaozhou Three-Circle Group Co Ltd, CCTC
, CN Manufacturer
Cearmic packages for SAW, XTAL, OSC. Glass-to-metal seals. Ceramic wire bonding capillaries. AlN, Al2O3 substrates, nano zirconia powder.
Indium Corporation
, US Manufacturer
Electroplating, fluxes, inorganic compounds, high purity metals, sintering pastes, solders, TIM, thin film materials.
Dow
, US Manufacturer
Adhesives, solvents for semiconductors
Parker LORD
, US Manufacturer
Die attach materials, encapsulation materials, underfills and gels, thermal greases.
NAMICS Corporation
, JP Manufacturer
Die attach materials, underfill materials. Conductive, EMI shielding pastes. Thermally and electrically conductive and insulating films.
TANAKA HOLDINGS Co., Ltd
, JP Manufacturer
Bonding wire. Precious metal materials for semiconductor industry: precursors for ALD/CVD, targets, die bonding adhesives and sealing materials.