Semiconductor Package


Substrate
IC chips are rapidly evolving. In order to maximize their performance, SHINKO provides substrates that have a variety of features for semiconductor packages.

Product Line-up
Flip-Chip Package Substrate PBGA Substrate PBGA Thin Substrate (Coreless) 2.3D Package Substrate Substrate w/Opt.-wiring Bendable Build-up Substrate


Leadframe
Widely used leadframe packages. SHINKO is manufacturing various types of leadframes by using ultra-precision stamping or chemical etching.

Product Line-up
Non-Lead Package Leadframe Leaded Package Leadframe Exposed Pad Leadframe Riveting Leadframe Pre-Plated Leadframe


IC Assembly
IC assembly for mounting IC chips in package, SHINKO is developing various interconnect technologies for supporting semiconductor packages from single-chip packaging to module assembly.

Product Line-up
Device Embedded Package (MEP) Bare Die Flip-Chip Package Molded Underfill FC Package Lidded FC Package Copper Pillar Bumping Power Device Package Sensing Edge Device


Glass-to-Metal Seals (GTMS)
Glass-to-Metal Seals made of metal and glass. SHINKO’s Glass-to-Metal Seals products are characterized by high hermeticity and superior electrical characteristics, and are widely used in products requiring high reliability, such as semiconductor laser and automotive device, etc.

Product Line-up
GTMS for LD Device GTMS for LD Light Source CAN PKG for Opt. Communication GTMS for Initiator


Thermal Management Parts・
Product for Semiconductor Manufacturing Equipment・
Metal Products


Thermal Management Parts
To solve heat generation issue from high performance IC chips, SHINKO has developed and supplied thermal management parts by using semiconductor packaging technologies and know-how accumulated over many years.

Product Line-up
Heat Spreader Micro Loop Heat Pipe


Product for Semiconductor Manufacturing Equipment
SHINKO produces ceramic products with technology accumulated over many years to meet customers' requirements.

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Ceramic Electro Static Chuck


Metal Products
SHINKO supplies various metal products by applying the metalworking technologies used for our semiconductor package such as leadframe and glass-to-metal seals.

Product Line-up
Motor Core Precision Die Parts

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