Thermal - Heat Sinks

RF series products, power series products, and high-end heat dissipation materials, and provides high-power packaging and testing services.

Copper-Carbon New Composite Materials and Heat spreader with strain balanced structure, commercializing high performance heat dissipation substrates with higher thermal conductivity and lower thermal expansion coefficient.

IC L/F QFJ, SOJ, TQFP, LQFP, QFP, TSOP, SSOP, SOP, ZIP, SDIP, DIP, QFN. LED Lead frames. Graphite / Cu+Film.

Thermal management products. Lead frames and other stamping and etching products.

Lead frames: HD-BU, HDL, PDIP, PLCC, QFN, QFP, TSOP/LOC, SOIC, Thermal Enhanced.

Thermal Heat Spreader, Semiconductor Leadframe, SMD LED Leadframe, EMI Sheilding Case, RF coaxial connector, DPC Thin-film Ceramic Substrate Components

Chip heatsinks, glass products. Silicon, metal, sapphire and ceramic products for semiconductor.

Lead frames, glass-to-metal seals, package substrates, ceramic wafer chucks, heat spreaders and micro heatpipes.