Etching and Fabrication Equipment

WET is a professional etching processing company, we can achieve a perfect etching tolerance of ±0.005mm. For stainless steel, copper, nickel, etc.

Wafer box, wafer carrier, wafer cassette, wafer carrier handle, RSP (reticle SMIF pod), RSP opener, mask case, chip tray, fluoro valves, cleanroom supplies, wafer and cassette cleaning systems

Tabletop Scanning Electron Microscope (SEM), Sample Preparation- Cross Section Polisher

on-demand atomic layer advanced manufacturing technology based on hybrid Microreactor Selective Area Direct Atomic Processing.

IC decapsulation systems. Dry Etching Systems. Failure Analysis Testing System.

Etch, evaporation, sputter and PECVD process systems for wafer processing and advanced packaging

Clean Room: Static Control, Storage Units, Cleaning Equipment. Process Equipment: Wet Etch Systems, Diffusion/Oxidation/Annealing, Developing.

Innovative plasma-based solutions for ashing, descum, surface preparation, isotropic etch, photoresist curing and charge erase that are used in the fabrication of integrated circuits.

Original equipment manufacturer of plasma etch (reactive ion etch), photoresist strip/ash/descum, and plasma enhanced chemical vapor deposition tools for the compound semiconductor, MEMS, opto-electronic and other markets