Founded in July 2018, Sky-semi dedicates to 5G RF devices packaging integration technology, main businesses include WLP for SAW/BAW filter, high frequency mmW integration, RF module integration, IPD passive components design and manufacturing. Through Bumping/WLCSP/TGV/Fan-out technology, Skysemi provides from the product collaborative design, process R&D to mass production of the integrated process solutions and services for customers.
