Scribe and Break Equipment

AI Vision Solution, AOI Solution(DISPLAY/ Secondary Battery/ Semiconductor/ Automobile, etc.), LASER Solution

Laser processing equipment for semiconductor, display, PCB

Sputtering System, OLED System, Solar Module System, AMHS, AS/RS, 3D Printer, Converting Machine

Auto wafer mounters, taping, laminator & presses, expanders, UV irradiators, breakers, grinding machines, lapping machines, polishing machines, and other tailor-made equipment in the LED, semiconductor, optical communication (5G)

Solder Ball Attach, Marking System, Laser Drilling, PKG Stack System, Package Laser Saw System, Flux Pre-Cleaning System, Substrate Merge & Sorting System, Loader & Offloader System, Router System, Solder Ball Attach Tool Kit, Pick & Place System

Display equipment: Edge Grinder, Edge Profiler, Drilling Machine, Cover Glass Grinder, OLED and FPD AOI Inspection and laser process equipment. Semiconductor equipment:FOUP Packing Machine, Wafer Grinder, Laser process equipment.

Mask Aligner, Total Lithography Solution, Spin Coater System, Mask Spin Cleaning System, Wet Station System, Exposure System, Glass Scribing Machine

LED equipment: LED Prober, Sorter, Die Transfer, Taping Machine, Phosphor Coater, CSP Blade Cutter, Dispenser. FPD Equipment: Laser Lift-Off, Laser Cutting System, Prober. Laser scribing and marking. Die (chip) transfer systems.

Dicing saw, MLCC cutter, sapphire wafer breaker for LED chip separation, tape mounting system, wafer wet spin cleaner,

Cleaving & Scribing Tool, LatticeAx, Flipscribe Systems, Glass & Sapphire Cleaving