DISCO Corporation

 , JP Manufacturer
Precision Machines: Dicing Saws, Laser Saws, Grinders, Polishers, Wafer Mounter, Die Separator, Surface Planer, WaterJet Saw. Precision Processing Tools: Dicing Blades, Grinding Wheels, Dry Polishing Wheels.

Nanjing Sanchao Advanced Materials Co., Ltd

 , CN Manufacturer
Manufacturer of all kinds of diamond and CBN tools. Diamond wire with a wide range of diameter and grain size. Diamond wheels for Semiconductor industries.

Kinik Company

 , TW Manufacturer
Abrasives, cutting tools and 8", 12" reclaimed wafers.