Underfill Materials

Electrically conductive adhesives, Thermally conductive adhesives, Thermal greases, Thermal Gap-fillers, Underfill, Glob top, Dam & Fill encapsulants, UV-curable adhesives, Potting resins.

Electronic insulating films, electronic one component epoxy adhesives. Functional chemicals

Underfill Materials, Die Attach Adhesives, Wafer Level Materials, Optoelectronic Materials, Conformal Coatings.

Resins, adhesives and inks for the electronics industry

Die attach materials, encapsulation materials, underfills and gels, thermal greases.

Die attach materials and conductive inks and pastes

Die attach materials, underfill materials. Conductive, EMI shielding pastes. Thermally and electrically conductive and insulating films.

Die attach and encapsulation materials for semiconductors. Adhesives for photovoltaic and optical applications.

Epoxy die attach adhesives. Epoxy systems for coating, encapsulation, potting and bonding.

Die attach and encapsulation materials for semiconductors. Adhesives for photovoltaic and optical applications.

Epoxy adhesives for die attach, encapsulation and optical applications.

CMP materials, lithography materials and services, semiconductor packaging and assembly materials, silicone products.

Die attach materials, adhesives for semiconductor and electronics industry. EMI shielding pastes and coatings.

Backgrinding and dicing tapes, DAF die attach films, polarizing films, encapsulation compounds, OLED materials.

Backgrinding, dicing and die attach films. Underfil and glob-top encapsulation materials. Thermal interface materials.