Dam and Fill Compounds

Special polymer materials for electronics

Electrically conductive adhesives, Thermally conductive adhesives, Thermal greases, Thermal Gap-fillers, Underfill, Glob top, Dam & Fill encapsulants, UV-curable adhesives, Potting resins.

Resins, adhesives and inks for the electronics industry

Semiconductor silicone and epoxy product sealants

Die attach materials, encapsulation materials, underfills and gels, thermal greases.

Die attach materials and conductive inks and pastes

Die attach and encapsulation materials for semiconductors. Adhesives for photovoltaic and optical applications.

Die attach and encapsulation materials for semiconductors. Adhesives for photovoltaic and optical applications.

Epoxy die attach adhesives. Epoxy systems for coating, encapsulation, potting and bonding.

Die attach and encapsulation materials for semiconductors. Adhesives for photovoltaic and optical applications.

Epoxy adhesives for die attach, encapsulation and optical applications.

CMP materials, lithography materials and services, semiconductor packaging and assembly materials, silicone products.

Die attach materials, adhesives for semiconductor and electronics industry. EMI shielding pastes and coatings.

Backgrinding and dicing tapes, DAF die attach films, polarizing films, encapsulation compounds, OLED materials.

Dicing, backgrinding and DAF die attach fil,s. Encapsulation materials for packaging. Coatings. Dia attach materials.

Backgrinding, dicing and die attach films. Underfil and glob-top encapsulation materials. Thermal interface materials.

Production and sale of high-end integrated circuit packaging materials (mainly used for semiconductor packaging high-end packaging materials), display and touch screen bonding Materials, smart card packaging materials.