oining wire and ribbon are widely used as electrical interconnect materials in manufacturing microelectronic devices. These products facilitate a bond between a chip and substrate or between two chips.
Spool Specifications
Coining can spool on all standard spools. In addition, we often use a special spool we have for large diameter material. Up to 5,000 feet of gold or silicon/aluminum wire can be supplied on a standard 2 inch diameter spool. Our new special spool for large diameter aluminum wire can hold up to 4,000 feet of 0.005 inch diameter wire.
Hermetic Packages
What We Do: Design and manufacturing glass-to-metal seal, ceramic-to-metal seals, and ceramic packages for devices needing protection from a host of environmental conditions. An electronic package is a hermetic housing that protects delicate circuitry for high reliability applications. Often the hermetic housing is the last assembly step before our customers ship their product.
Hermetic Packaging
CNC Machined Housings Electronic Packaging AMETEK ECP
Machined Housings
AMETEK has the engineering skills and the production capacity to solve any high reliability interconnection problem, utilizing glass-to-metal-sealing or molding technology using PEEK (polyether ether ketone) polymers ... Keep ReadingAMETEK Electronic Components and Packaging - Flatpacks
Flatpacks
AMETEK manufacturers hermetic microelectronic packages including a variety of flatpack packages. Our capabilities include special connectors, fiber optic ports, unusual lead forming, and brazing dissimilar metals ... Keep ReadingAMETEK Electronic Components and Packaging Metal Platforms
Metal Platforms
AMETEK manufacturers hermetic microelectronic packages including a variety of metal platform packages. Most Platform Plug-ins are designed to accommodate the use of a domed cover or lid. Platform Plug-ins can have vi... Keep ReadingAMETEK Electronic Components and Packaging Plug-Ins
Plug-Ins
AMETEK manufacturers hermetic microelectronic packages including a variety of plug in packages, where leads or I/O’s extend out the bottom of the enclosure Keep ReadingAMETEK Electronic Components and Packaging Power Surface Mounts
Power Surface Mounts
AMETEK manufactures hermetic microelectronic packages including a variety of power surface mounts. Our patented power surface mountable design is a very low thermally resistive, highly efficient, small, hermetic, sur... Keep ReadingHTCC Circular Electronic Packaging AMETEK ECP High Temperature Cofired Ceramics General Ceramics
Ceramic Feedthroughs - HTCC
A high temperature co-fired ceramic package (HTCC) is a multilayered, sealed and highly reliable package created using layers of ceramic tape with thicknesses ranging from 5 to 25 millimeters, which are laminated toge..
