Bonding wire and ribbon are thin metal wires or strips used in the manufacturing of electronic components, particularly in the semiconductor and microelectronics industries. These materials are used to establish electrical connections between different parts of an electronic device, such as connecting an integrated circuit chip to a leadframe or a printed circuit board.
Bonding wire is a thin metal wire typically made of gold, aluminum, or copper, with a diameter ranging from a few microns to a few tens of microns. It is used to make wire bonds, which are small electrical connections between two points in an electronic device. The wire bonding process involves the use of specialized equipment, such as wire bonding machines, which use heat, pressure, and ultrasonic energy to weld the wire to the contact pads on the device.
Bonding ribbon is a flat strip of metal, typically made of gold or copper, that is used to make ribbon bonds. Ribbon bonds are wider and flatter than wire bonds and are used for making larger electrical connections in electronic devices. The ribbon bonding process is similar to the wire bonding process, but uses specialized equipment and tools designed specifically for ribbon bonding.
The choice of bonding wire or ribbon depends on several factors, including the size and shape of the contact pads on the device, the distance between the contact points, and the required electrical and mechanical properties of the connection. Gold wire and ribbon are commonly used in high-reliability applications, such as aerospace and medical devices, due to their excellent conductivity, corrosion resistance, and durability.