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Tools

Semiconductor assembly and packaging involve the manufacturing processes that take place after the semiconductor wafer has been fabricated. These processes include die preparation, wire bonding, encapsulation, and testing. Some common tools used in semiconductor assembly and packaging include: Die attach tools: These tools are used to attach bare semiconductor dies to leadframes or other substrates. They use a variety of techniques, including epoxy or solder bonding, to create a strong and reliable bond between the die and the substrate. Wire bonding tools: These tools are used to create electrical connections between the semiconductor die and the leadframe or substrate. They use thin metal wires, typically made of gold or aluminum, to make the connections, and can employ ultrasonic, thermal, or thermocompression bonding techniques. Molding equipment: This equipment is used to encapsulate the semiconductor die and wire bonds in a protective resin or plastic material. This process helps to protect the semiconductor device from mechanical stress, moisture, and other environmental factors. Laser marking and trimming tools: These tools are used to mark and trim the leadframe or substrate after the semiconductor die and wire bonds have been attached. This helps to identify and distinguish between different devices and allows for precise adjustment of device characteristics. Testing equipment: This equipment is used to test and verify the performance of the finished semiconductor device. It may include specialized equipment, such as probe stations or automated testing machines, to perform electrical, mechanical, or environmental tests. Other common tools used in semiconductor assembly and packaging include pick and place machines, tape and reel equipment, plasma cleaning systems, and inspection tools. These tools are designed to help semiconductor manufacturers achieve high levels of precision, reliability, and efficiency in their manufacturing processes.

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MSW SUNGJIN TECH

, KR Manufacturer

Tools for semiconductor assembly: DIE BONDING TOOL, WIRE BONDING, DISPENSING, BACK END, PRECISION TOOL, ACCESSORY, FLIP CHIP, TAPE & REEL

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LONGYI PRECISION TECHNOLOGY CO., LTD.

, TW Manufacturer

Precision ceramic parts, porous vacuum chuck, die bonding tools, CNC machining parts, and customized tools

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Tecdia Inc.

, US Manufacturer

Thin-Film Substrates, Ceramics Products, Precision Products, Diamond Products, Contract Manufacturing Services

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Chengdu Yeheng Electronic Co Ltd

, CN Manufacturer

Precision instruments for semiconductor and electronics: Wire guide, Cutter, Clamp Finger, Bonding Wedge, Ceramic capillary

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JSC Kontur

, RU Manufacturer

Die collets, probe pins, wire bonding capillaries, electrodes, technical ceramics.

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Small Precision Tools, Inc.

, US Manufacturer, Service Company

Bonding Capillaries, Die Bonding, Flip Chip Handling, Wedge Bonding, Single Point-TAB Bonding Tools

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MATRIX TECHNOLOGIES PTE LTD

, SG Custom Manufacturer, Distributor, Service Company

Precision Tooling, Air Spindles & Wafer Chucks Refurbishment, PCB Refurbishment, Automation Solutions, Used Equipment Sales & OEMs Manufacturing

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Micro Point Pro LTD.

, IL Manufacturer

Die and wire bonding tools, fluid and solder dispencing tools, manual die bonders, 4-point probes.

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