Ceramic Packages

Hermetic packages: Opto-Electronic Packages, Power Packages, Microwave Packages, HIC Packages, TO Headers, Circular Packages, Sensor Packages, High Purity Graphite Molds, Kovar Lids

Multilayer co-fired ceramic packages (HTCC, LTCC), ceramic substrates

AMB ceramic substrates. Research, design and prototype advanced packaging concepts. Low to medium package assembly and transfer to volume OSATs. Advanced transfer molding and sintering systems

Ceramic metallized substrates (DBC, AMB), ceramic packages for LED, IC

Ceramic packages, organic packages and module substrates, HDI PCB, PWB, single crystal sapphire products, semiconductor/LCD processing equipment

IC substrates and HDI PCB.

Metal microelectronic packaging lid products and integrated circuit packaging shell.

direct copper ceramic (DPC) circuit board such as LEDs Al2O3/AlN fine ceramic substrates , Flesh light module DPC , IR/UV , lighting ,Laser and Automotive used DPC substrate and sub-mount.

High-Purity Advanced Ceramics for Semi Wafer Processing. Clean, Durable Ceramic Components for OEM Semiconductor Processing Equipment. Thick-Film Electronic Substrates, Thin-Film Electronic Substrates, RF & Microwave.

High power RF packaging solutions. Hermetic packages.

Daisy Chain test components, zero ohm PCB jumpers and engineering evaluation kits for experimentation. We make vibration dampers to extend the life of PCB assemblies and CCGA Column Grid Array to reduce stress caused by extreme thermal CTE mismatch.

Cearmic packages for SAW, XTAL, OSC. Glass-to-metal seals. Ceramic wire bonding capillaries. AlN, Al2O3 substrates, nano zirconia powder.

AlN ceramic thermal heaters, ceramic and metallized ceramic substrates, LTCC and AlN multilayer ceramic packages.

Lead frames, glass-to-metal seals, package substrates, ceramic wafer chucks, heat spreaders and micro heatpipes.

Bonding wire and ribbon, hermetic packages and lids, connectors.

manufacturing direct copper ceramic (DPC) circuit board such as LEDs Al2O3/AlN fine ceramic substrates , Flesh light module DPC , IR/UV , lighting ,Laser and Automotive used DPC substrate and sub-mount.

Custom manufacturer of ceramic packages.

Manufacturer of precision passive components, hybrids, and packages.

Manufacturer of custom hermetic packages, glass-to-metal and ceramic-to-metal seals, feedthrough products.

Manufacturer of HTCC ceramic packages, DBC and AMB substrates, pressed ceramic lids and bonded wafers.