Lids

Hermetic packages, glass-to-metal seals

Hermetic packages: Opto-Electronic Packages, Power Packages, Microwave Packages, HIC Packages, TO Headers, Circular Packages, Sensor Packages, High Purity Graphite Molds, Kovar Lids

Open Cavity QFN package and lids, test sockets, bonding wire

Metal microelectronic packaging lid products and integrated circuit packaging shell.

Lead frames, TO- headers, ceramic packages, stamping and molding dies, press mold equipment.

RF/EMI shields, screens, contacts, connector housings, lead frames, apertures, laser cut SMT stencil

Molding compounds for electronic packages. EMC, coatings for opto and semiconductor products.

Lead frames, glass-to-metal seals, package substrates, ceramic wafer chucks, heat spreaders and micro heatpipes.

Bonding wire and ribbon, hermetic packages and lids, connectors.

Custom manufacturer of ceramic packages.

Manufacturer of custom hermetic packages, glass-to-metal and ceramic-to-metal seals, feedthrough products.

Manufacturer of HTCC ceramic packages, DBC and AMB substrates, pressed ceramic lids and bonded wafers.