Open Cavity Plastic Packages

Electronic Products (EPI) manufactures high-quality hermetic electronic packaging using advanced glass-to-metal and ceramic-to-metal sealing technologies, tailored for harsh environments and critical applications.

Air Cavity Near Hermetic Semiconductor Packaging. Air Cavity Plastic Packages, B-Stage Components, Sealing Equipment ​

Pre-molded Lead Frame Package (Air Cavity Package) and Lid Cover

Open Cavity QFN package and lids, test sockets, bonding wire

LED Lead Frames, Discrete, Transistor, IC Lead Frames, VFD Frame, BGA Heatsink, FPC

IC Packaging Service, Open Cavity Packages, Test Socket, Polyimide(PI)

Lead frames, TO- headers, ceramic packages, stamping and molding dies, press mold equipment.

direct copper ceramic (DPC) circuit board such as LEDs Al2O3/AlN fine ceramic substrates , Flesh light module DPC , IR/UV , lighting ,Laser and Automotive used DPC substrate and sub-mount.

Daisy Chain test components, zero ohm PCB jumpers and engineering evaluation kits for experimentation. We make vibration dampers to extend the life of PCB assemblies and CCGA Column Grid Array to reduce stress caused by extreme thermal CTE mismatch.

Open cavity plastic packages, wafer preparation services, wafer dicing, IC and MEMS packaging.