Click for Details. Air Cavity Pre-Molded Open Caviy QFN ready for die and wire bonding
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M-QFN Series
Open Cavity QFN Packages
Bonding Wire made by Tanaka
Bonding Wire
All Types: Au, Al, Ag, Cu-Pd
Made by Tanaka
Test IC Socket by E-tec
IC Test Socket
Widest Range
Made by E-tec
Open Cavity (air cavity) QFN package:
•MEMS, RF, sensor, and silicon applications.
•Ready for die attach and wire bonding.
•Cu alloy leadframes.
•For engineering and rapid prototypes.
•40 open tooled packages
•Complies to JEDEC Standard MO-220 VQFN
Lids Flat and dome covers.
QFN Sockets Window for probing into cavity.
Engineering Kit Packages and lids for evalution.
CAD DXF, SAT, IGES, STEP and PDF drawings center.
Wire Bondable Daisy Chain Test Die by TopLine
Wire Bondable
Daisy Chain
Test Die
