QP Technologies (formerly Quik-Pak), a division of Promex Industries, is based in Escondido, Calif. We are leaders in microelectronic packaging, assembly, wafer processing, substrate design, and other related services. Our 20,000-square-foot facility is ISO 9001:2015 and ISO-13485:2016 certified, and ITAR registered. These certifications are important to ensure we meet your requirements for quality, regardless of the market(s) that you are working in.

Our over-molded QFN/DFN packages and pre-molded air-cavity QFN packages (OmPP) offer a fast, convenient solution for your needs, ranging from prototype to volume production. We offer same-day assembly services that reduce your time to market, while our advanced assembly services can accommodate such structures as flip chip, stacked die, SiP, chiplets, MCM and CoB.


Promex Industries
Our parent company, Promex Industries, specializes in design, packaging and heterogeneous assembly of complex medical and biotech devices for a variety of applications, including microelectronic subassemblies; Class II & III implantables and wearables; custom sensors and transducers; microfluidic, ultrasound and disposable devices; high-resolution imaging arrays; and camera and diagnostic equipment.

Promex Industries is located in Silicon Valley, and provides design-for-manufacturing (DFM) services, materials science expertise and broad assembly capabilities for small- to mid-volume onshore production. Among Promex’s services are RoHS-optimized surface-mount technology (SMT), wafer thinning, dicing, wire-bonding, flip chip, and overmolding, which are performed in Class 100 and Class 1000 cleanrooms. Like QP Technologies, Promex is ISO 13485:2016 and ISO 9001:2015 certified and ITAR registered, as well as IPC certified.

At QP Technologies (formerly Quik-Pak), we are committed to sustaining and growing our line of industry-leading packages and substrate capabilities to ensure we have what you need when you need it. We have demonstrated and verified the effectiveness of our products and processes. You can depend on us to address your packaging, assembly and wafer-preparation needs, whether urgent or longer-term, with the same attention to quality and speed of delivery.

With our state-of-the-art manufacturing line, proven processes, and engineering brain trust, we have the flexibility to address your specific needs, using our proven packaging technologies. We can provide virtually any package you need for your prototype devices, including Open-molded Plastic Packages (OmPP)®, Open-cavity Plastic Packages (OCPP)®, ceramic and plastic IC packages, laminate substrates, and even custom IC package configurations.

Our exclusive OmPP line of pre-molded, air-cavity quad flat no-lead (QFN) packages come in a variety of sizes for prototype, mid-volume or volume production. Our Open-cavity Plastic Packages (OcPP) are mechanically and electrically identical to your future transfer molded production parts, so they are well suited for new IC prototypes and help to speed your design veri­fication and time to market.

We also offer a full complement of substrate development capabilities for advanced IC and MEMS devices. By providing turnkey custom substrate-based assemblies – from design to fabrication to packaging – we can meet your unique and complex packaging requirements in very short order.

OCPP
QP Technologies (formerly Quik-Pak) can provide virtually any IC package you need for your prototype devices, such as Open-molded Plastic Packages (OmPP)®, Open Cavity Plastic Packages (OCPP)®, ceramic IC packages, laminate substrates and even custom IC package configurations.

If you don’t have a specific IC package identified, we can provide technical assistance to select the best IC package for your application.

Open Cavity Plastic Packages (OCPP) are the ideal platform for new IC prototypes, because they are mechanically and electrically identical to your future transfer molded production parts. QP Technologies can convert any existing IC plastic packages, whether dummies, electrical test rejects or excess inventory, into open cavity packages, ready to be assembled with your new die.

QP Technologies’ proprietary reconfiguration process is applicable to packages that you provide or we procure for you, in any size or lead count. Available IC package types include:

BGA
DIP
MLF / MLP / QFN / DFN / LPCC, Open-molded Plastic Packages (OmPP)
PLCC
QFP / LQFP / PQFP / TQFP
SSOP / TSOP / TSSOP / SOIC / SOJ / MSOP / QSOP
SOT / SC / TO / DPAK
 

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