finishing for wafer;plating for ic packaging;vertical continuous plating system and bath control unit

 

Uyemura(Shanghai)Co.,LTD. Established in 2002, is invested 100% by Uyemura&Co.,Ltd
In Wafer field,Uyemura focus on providing UBM process related surface finish chemical,equipment and technical support.
UBM process is capable for application of Power devices(IGBT\DIODE Etc)、Discrete devices、Logtic LSI(DRAM、Flash Etc)、Package(WLCSP Etc)、CCD device and LED, available for selective process, no need electricity plating,high uniformity, excellent WB and SJR reliability, low equipment invest requirement, high production capacity.

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