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LTCC

LTCC stands for Low Temperature Co-fired Ceramics. It's a multi-layer ceramic substrate technology used in microelectronics packaging. LTCC substrates are made by laminating and co-firing multiple layers of ceramic tape. The tape can be printed with conductor and resistor patterns, and interconnect vias between layers. LTCC substrates are known for their good electrical properties, high reliability and hermeticity, and are often used in applications such as RF components, micro-electromechanical systems (MEMS), and high-density power modules. HTCC is a acronym for High Temperature Co-fired Ceramic, which is a type of ceramic substrate material used in microelectronics packaging. HTCC is known for its high temperature stability, thermal conductivity, and hermetic sealing capability, which makes it suitable for use in harsh environments or high-performance applications. The material is made by firing multiple layers of ceramic and metal together to form a monolithic structure, and it is commonly used for high-performance packages such as power amplifiers and microwave components. Manufacturers of LTCC products are Maruwa, Murata, DuPont, ACX, TDK, Ferro, Balun etc

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KOA CORPORATION

, JP Manufacturer

Development, manufacture and sales of electronic components.

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SHINKO ELECTRIC INDUSTRIES CO., LTD

, JP Manufacturer

Lead frames, glass-to-metal seals, package substrates, ceramic wafer chucks, heat spreaders and micro heatpipes.

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Adamant Namiki Precision Jewel Co., Ltd

, JP Manufacturer

Sapphire wafers and parts, capillaries and other precision tools, LTCC.

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