Wafer Cases
Shin-Etsu Polymer has two kinds of front opening shipping boxes (FOSBs) used for transporting wafers between wafer and device manufacturers. We also make front opening unified pods (FOUPs) for device makers' manufacturing processes. Shin-Etsu Polymer's FOSBs and FOUPs are known for their high quality and reliability in the global semiconductor industry. Click here for details.

 
『SEPLEGYDA®』
Polythiophene-base conductive polymer

『SEPLEGYDA®』
SEPLEGYDA is possible to provide thin conductive layer by coating.
There are many formulations depending on resistivity, from low resistance(10²~10³Ω/sq) to high resistance of anti-static area(10⁴~10¹⁰Ω/sq).

 
『Shin-Etsu Sepla Film®』
The high-functioning engineering plastic film

『Shin-Etsu Sepla Film®』
Shin-Etsu Sepla Film® is a super engineering plastic film . It is a non-stretched film made of PEEK, a super engineering plastic. It is available as either a thick or thin film.

 
『Shin-Etsu Carrier tape』
Embossed/Blister carrier tape

『Shin-Etsu Carrier tape』
Packing materials for semiconductors, electronic devices.

 
『Shin-Etsu Top tape』
Top cover tape

『Shin-Etsu Top tape』
Heat activated sealing films for cover film of embossed carrier tapes.

 
『Shin-Etsu Light Frame®』
『Shin-Etsu Light Frame®』
Frame for wafer dicing process.

Files