Printing pads are materials used in the process of depositing paste on printed circuit boards (PCBs) in the surface mount technology (SMT) assembly process. The paste, which typically contains a mixture of metal particles and a flux, is used to form electrical connections between the components and the PCB. Printing pads are placed on top of the PCB and have a shape that matches the pattern of the desired paste deposit. A stencil is then placed over the printing pad, and the paste is squeegeed through the stencil and onto the PCB. Printing pads are typically made of a soft material, such as silicone, which allows for a uniform and consistent transfer of paste onto the PCB. They must also be durable enough to withstand the pressure of the stencil and the paste during the printing process.