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TAB Tape Automated Bonding Accessoires

Tape Automated Bonding (TAB) is a method of interconnecting integrated circuits (ICs) and other components to a printed circuit board (PCB). TAB accessories refer to the additional equipment and materials required to perform TAB, such as tape, covers, frames, pull-tabs, bonding tools, etc. TAB accessories are critical for ensuring the accuracy and reliability of the TAB process, and must be chosen based on the specific requirements of the application. TAB (Tape Automated Bonding) tapes are used in the manufacture of microelectronics components and packages. The process involves bonding of thin metal leads to the dies/chips using a special tape that has a metal pattern and an adhesive layer. The metal leads are then connected to the substrate or lead frame. This process is known as TAB and the tapes used are called TAB tapes. TAB technology provides a cost-effective, high-yield method for the packaging of microelectronics components. TAB (Tape Automated Bonding) covers are protective films or materials used to cover and protect TAB tapes during the handling, storage, and transportation of TAB-bonded integrated circuits (ICs). The covers protect the delicate TAB tape and the bond pads from damage and contamination. The covers are usually made of polyimide, a type of plastic material with excellent temperature resistance and dimensional stability. They can be supplied in different thicknesses, sizes, and shapes to fit different TAB tapes and IC packages. The TAB covers are usually removed before the IC is assembled into a larger electronic system. Tab bonding tools are equipment used in the Tape Automated Bonding (TAB) process to secure microelectronic devices such as integrated circuits (ICs) to a flexible printed circuit (FPC) or a printed wiring board (PWB). These tools usually consist of a bond head, a tape feeder, and a control unit. The bond head is responsible for bonding the ICs to the FPC or PWB, the tape feeder provides the TAB tape, and the control unit manages the bonding process. Some of the commonly used tab bonding tools are thermal compression bonders, thermo-compression bonders, and ultrasonic bonders.

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CRESSEM Ltd

, KR Manufacturer

AI Vision Inspection, Ultrasonic ACF Bonding

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JSC Kontur

, RU Manufacturer

Die collets, probe pins, wire bonding capillaries, electrodes, technical ceramics.

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Small Precision Tools, Inc.

, US Manufacturer, Service Company

Bonding Capillaries, Die Bonding, Flip Chip Handling, Wedge Bonding, Single Point-TAB Bonding Tools

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Toyobishi Corporation

, JP Distributor

TAB tape, BT resin substrate, Ceramic substrate, Aluminum substrate, Back grinding wheel, dicing blades, Dicing tape, Die bonding pin, Silver paste, Golden wire

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