Wafer Protection Film
●Application for WLCSP & Fan-Out process, can reduce the defects caused by cutting the wafer.
●Excellent laser marking quality.
●Excellent adhesion performance with metal .
●Excellent heat dissipation.
●Application for Infrared (IR) Transmission inspection of wafer backside.
●Control wafer warpage for RDL process.
●Can Customize film feature i.e. magnetic, transparent...etc.
●Eco-friendly, do not contain toluene
Width:
220mm for 8” Wafer
330mm for 12” Wafer
500~680mm for Panel Size
Customized Size
Thickness:
20 ~ 200 um
Applications:
SiP, WLP, WLCSP, Flipchip, Stacked die, Fan-out, Fan-in, 3D IC
Wafer Warpage Control Film
●Can control any wafer warpage for RDL process.
●Excellent laser marking quality.
●Excellent adhesion performance with metal .
●Excellent heat dissipation.
●Application for Infrared (IR) Transmission inspection of wafer backside.
●Can Customize film feature i.e. magnetic, transparent...etc.
●Eco-friendly, do not contain toluene
Width:
220mm for 8” Wafer
330mm for 12” Wafer
500~680mm for Panel Size
Customized Size
Thickness:
20 ~ 200 um
Applications:
Fan-Out, Fan-In, WLCSP, SiP, 3D IC packaging
Transparent Molding Film
●Independent research and manufacure in Taiwan
● Transparent feature let 3D IC packaging stack and align easily.
●Excellent adhensive performance, chemical resistance and grinding material.
●Excellent gap filling ability, protect device from moisture damage.
●Low CTE and no die-shift.
●Low Dk & Df.
●Eco-friendly, do not contain toluene.
Width:
220mm for 8” Wafer
330mm for 12” Wafer
500~680mm for Panel Size
Customized Size
Thickness:
20 ~ 200 um
Applications:
Fan-Out, Fan-In, WLCSP, SiP, 3D IC packaging
Mini/Micro LED packaging (Effective protection of LED chip and prevent falling off)
