Expansion Ring

Tools for semiconductor assembly: DIE BONDING TOOL, WIRE BONDING, DISPENSING, BACK END, PRECISION TOOL, ACCESSORY, FLIP CHIP, TAPE & REEL

CHILLER, HEAT EXCHANGER, SCRUBBER, TEST CHAMBER. RETAINER RINGS and OTHER PROCESSING PARTS

Wet Cleaning Systems and Chemicals, UV Ozone Cleaner, Wafer Mounter, Wafer Expander, Grip Ring, UV Curing System

Dicing saw machine, wafer tape mounter, wafer expander, UV irradiation machine, wafer cleaning machine. Dicing and back grinding supplies: blades, chucks, UV films, spindles etc.

IC assembly tools. Wafer handling, die bonding, wire bonding tools. Lead frame and PCB magazines.

Dicing saw, MLCC cutter, sapphire wafer breaker for LED chip separation, tape mounting system, wafer wet spin cleaner,

Dicing tapes, wafer mounters, die ejector, pick and place system, die matrix expander, die bonders, FOUP and cassette cleaners

Manufacturer of Wafer Mounters, Laminators, UV curing stations, as well as accessories such as frames, films, magazines.