Semiconductor
Integrated wet chemical process and equipment solutions for advanced packaging, semiconductor
Quick facts
Advance packaging solutions with electroless and electrochemical deposition of Cu, Ni, Pd, Sn, SnAg and Au
Electrochemical solutions for latest interconnnect technology – Damascene Cu and Co
MultiPlate: an innovative electrochemical plating tool
High tech clean room manufacturing
Applications
Pad metallization with ENEPIG for power chips and memory
RDL, µ-Vias and pillar plating for FOWLP and FC-CSP
µ-Via and through silicon via plating for sensors and 3D stacking
Double sided metallization for power chips , e.g. IGBT, MOSFETS…
Interconnect metallization for logic, memory and power ICs
Product portfolio
RDL, µ-Vias and Pillar plating for FOWLP and FC-CSP
Your challenge:
Latest packaging technologies as FOWLP require a variety of plating solutions for different structures. Cu for fine line RDL with and without filled µ-Vias, Cu pillars with and without Ni barrier layers and last but not least SnAg for solder caps on pillars. Paramount is the purity of the Cu deposit to improve the overall reliability. The purity of the Cu deposit determines the reliability of the whole package avoiding RDL cracks in FOWLP or micro voiding at Cu/solder interfaces

Our solution:Atotech offers the full plating package for pillars, µ-Vias and fine line RDL Highest purity Cu deposits for the toughest reliability requirements, be it RDL , µ-Vias or Cu pillars. One for all Cu solution. Our Cu electrolyte plates every structure: µ-Vias, fine line RDL and pillars

Our products:

Spherolyte® Cu UF5: High speed Cu pillar plating with outstanding uniformities
Spherolyte® Cu UF3: Pure performance for all Cu structures: RDL, µ-Via s and pillars
Promobond® AP2: Adhesion promoter for next generation packaging
Spherolyte® Ni: Effective barrier layer between solder and Cu to avoid a void
Spherolyte® SnAg: Our latest product for a reliable interconnect with 2 % Ag
Double sided metallization for power chips, e.g. IGBT, MOSFETS...
Pad metallization and RDL housing
Interconnect metallization solutions for logic, memory and power ICs
Featured products

Spherolyte® Cu UF5
High speed Cu pillar plating with outstanding uniformities

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Spherolyte® Cu UF3
Universal Cu plating suite for RDL and micro via filling

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Promobond® AP2
Adhesion promoter for next generation packaging

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Xenolyte® Ni TR
Enhanced chemistry for broadly applicable and low stress electroless Ni deposition

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High-purity chemistry manufacturing
High purity chemistry production
Cleanroom manufacturing for the semiconductor industry
We produce high purity chemistry according to the latest and most stringent semiconductor industry requirements. Our 1,500m² cleanroom manufacturing facility located in Neuruppin, Germany is equipped with highly automated manufacturing equipment and enclosed production environments to ensure efficient, safe, environmental, and cost effective production.

Surface treatment
Integrated wet chemical process and equipment solutions for package substrates and printed circuit boards (HDI/MLB and Flex/Flex-Rigid)
Quick facts
Global market leader in I/L bonding
Special copper pretreatment solutions
Advanced adhesion promoters and etchants
Photoresist stripping optimized for fine line
manufacturing
Applications
Bonding enhancement
5G Bonding Applications
Advanced surface preparation
Photoresist stripping
PCB and package substrate applications
Product portfolio
Bonding enhancement

Nano-structure formed byNovaBond® IT

NovaBond® IT: A non-etching adhesion promoter that promotes reliable mechanical adhesion for IC-Substrate and high frequency materials.The NovaBond® IT process also provides good thermal reliability and is also compatible for solder resist materials. Due to its non-etching nature it shows significant benefits on signal integrity especially in high frequency applications.
Multibond®: This Black Oxide process can be operated over a wide range of temperatures and dwell times to produce a variety of bonding properties, depending on the specific applications.
BondFilm®: Atotech’s simple and economic oxide alternative process for improved inner layer bonding. With over 400 lines and installations worldwide Atotech leads this market segment globally and contributes to the success of many key PCB manufacturers.
BondFilm®MS 1000/HP: A low sludge version of BondFilm® MS 1000/HP gives great operational benefits, significantly reduce equipment maintenance and downtime frequency.
5G Bonding Applications
Advanced surface preparation
Photoresist stripping
Metal stripping
Direct metal deposition on molding resin
Adhesion promoter for plating on glass
 Featured products

BondFilm® LDD MSAP
LDD pretreatment for advanced mSAP applications

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VitroCoat® GI
Adhesion promoter for directly plating on glass

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CupraEtch® SR
Reliable photoresist and soldermask adhesion, surface roughness

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NovaBond® IT
Advanced non-etching adhesion promoter for IC-Sub./HF applications

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Horizon® BondFilm
Integrated production solution for bonding enhancement and surface treatment technologies
The Horizon® BondFilm system offers Atotech’s latest technology package in chemical processing, thin material conveyance and fluid delivery.

Horizon® BondFilm LDD – a unique process to improve CO2 laser absorption of surfaces prior to laser direct drilling applications at maximum reliability
CupraEtch® – a unique multipurpose micro-etch system for best adhesion of primary imaging resists or solder masks in the production of high quality printed circuits

Our unique systems approach
Inline processing for printed circuit boards (HDI/MLB and Flex/Flex-Rigid Boards), package substrates, and semiconductor applications
Quick facts
Unique systems approach: Supplying chemistry, equipment, process know-how, service and spare parts
Leading sustainable solutions
Two production sites in Germany and China
Clean room production capabilities in Germany
Applications
Printed circuit boards (HDI, MLB, Flex / Flex rigid boards)
IC substrates
Semiconductor
Advanced packaging
Flat panel displays
Product portfolio
Permanganate desmear
 

Atotech’s versatile desmear equipment Uniplate® P allows high throughput rates, from multilayers to thicker boards and HDI boards or bare laminate boards for semi additive processes, giving the best results with almost all available base material (except chemical non-resistant substrates and materials containing acrylic adhesives). More than 380 Uniplate® P lines have been installed for high volume production of MLBs, HDIs and IC substrates for high-end applications such as mSAP/amSAP. It provides the leading transportation capability for thinnest PBS boards going down to 25µm + 2×2µm Cu clad.

Our Uniplate® P has a long successful tradition. Based on this Atotech has developed the next generation „New Uniplate“ design which is incorporating all the benefits and advantages of our traditional Uniplate® PLB platform. On top of this, the „New Uniplate“ features advances and benefits in reduced footprint, enhanced maintenance and user friendliness, energy consumption reductions, new pump technology and sustainable process control. Following the technology requirements, we improved the fine line capability by adding many sophisticated solutions for particle avoidance and particle reduction.

 

Equipment highlights:

High quality stainless steel sweller and permanganate modules ensure maximum process stability and low maintenance
Integrated stainless steel filtration system for sweller and permanganate
Designed to save resources – highly efficient chemical regeneration system for continuous production at stable process parameters (patented Oxamat® for permanganate regeneration) and sophisticated rinse concept
High level of automation and process control combined with the smart use of production data ready for FAB 4.0
Strong process performance with with patented flood bar technology
 

 

The Polygon P line is Atotech‘s new desmear equipment for printed circuit board manufacturers with high reliability and high performance demands in multilayer, rigid-flex and HDI panel processing. The new horizontal line is available in line speeds up to 3.5m/min with to different transportation systems for 24“ and 28,5“. Polygon Line series features all production-critical characteristics and applies them to a highly reliable, high-volume, and cost-effective machine.

Equipment highlights:

Equipped with technology to reduce consumption of water and chemistry (e.g. patented Oxamat for permanganate regeneration, encapsulated modules, minimal bath volumes, multi-stage cascade rinses and condenser units)
Strong desmear performance with ultra sonic devices for sweller and permanganate
The line is available with steam or hot water heating to use existing heat sources at customer site and save electrical energy consumption
Strong process performance with patented flood bar technology


Electroless copper process
Direct plating
Horizontal electrolytic copper process
Vertical electrolytic copper process
Surface treatment / Innerlayer bonding
Final finishing
Electrolytic plating for the semiconductor and advanced packaging industry
Electroless metallization for displays
Service and spare parts
Featured products

MultiPlate®
Innovative electrochemical plating system for next generation packaging

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Polygon PLB line®
New cost-effective plating tool for highly reliable, high-volume PCB production

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vPlate®
New vertical continuous copper plating equipment

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Uniplate® PLBCu6
Market leading hor. inline production equipment for mSAP technology

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High-purity chemistry manufacturing
Transportation technology
Universal transport system (UTS) – For ultra flex material processing (UTS-xs)
Atotech’s Universal Transport System is designed to enable Atotech’s desmear, PTH and copper plating equipment to process a broad range of different panel thicknesses. The Universal transport system consists of UTS-XL, UTS-s, UTS-xs and the new UTS-xs+. It is the latest addition to the UTS that opens new possibilities for safe thin material transportation in our Uniplate® P and LB lines.

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