AMB Metallized Ceramic Substrates

AMB ceramic substrates. Research, design and prototype advanced packaging concepts. Low to medium package assembly and transfer to volume OSATs. Advanced transfer molding and sintering systems

Ceramic metallized substrates (DBC, AMB), ceramic packages for LED, IC

Vacuum Feedthrough, Quartz, Ceramics, SiFusion Silicon parts, Silicon Wafers, Process Tool Parts, Cleaning, Temescal Systems

Semiconductor equipment parts: vacuum feedthrough, quartz products, fine ceramics products, silicon parts, CVD-SiC products, machinable ceramics products, quartz crucible, silicon wafers. Electronic device products: ferro fluids, power device substrates.

Epoxy molding compounds, die attach adhesives, DBC and AMB ceramic substrates, metallized ceramics.

Manufacturer of HTCC ceramic packages, DBC and AMB substrates, pressed ceramic lids and bonded wafers.