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Bonded Wafers

Bonded wafers are wafers that have been joined together to form a single piece. The bonding process is usually performed using a layer of material with a high melting point, such as silicon dioxide or silicon nitride, as an adhesive between the two wafers. This bonding process can result in several benefits, including: Improved electrical performance: Bonded wafers can result in improved electrical performance compared to individual wafers, due to the reduced resistance and capacitance between the layers. Enhanced thermal conductivity: Bonded wafers can offer enhanced thermal conductivity, which is important for many high-performance applications such as power electronics, LED lighting, and high-frequency communications. Improved mechanical strength: The bonding process can also result in improved mechanical strength, as the layers are held together by the strong adhesive layer. This can be important for applications where the wafers are subjected to high levels of stress or pressure. Reduced risk of contamination: Bonding wafers together can reduce the risk of contamination between the layers, as the adhesive layer acts as a barrier. This is important for many clean room applications, such as microelectronics and photonics. Bonded wafers are used in a variety of applications, including microelectronics, photonics, power electronics, and LED lighting. The type of bonding process used will depend on the application and the specific requirements of the wafers.

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Shenyang Silicon Technology Co., Ltd.

, CN Manufacturer

8" thin-film SOI, 8" epitaxial SOI, 6"-8"thick-film SOI, 6"-8" direct bonded silicon wafer, 6"-8" patterned SOI, 8"ultrathin film SOI and 8"epitaxial wafers.

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NGK Insulators, Inc

Tokyo, JP Manufacturer

Manufacturer of HTCC ceramic packages, DBC and AMB substrates, pressed ceramic lids and bonded wafers.

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