Soitec
, FR Manufacturer
SOI wafers and engineered substrates
NGK Insulators, Inc
Tokyo, JP Manufacturer
Manufacturer of HTCC ceramic packages, DBC and AMB substrates, pressed ceramic lids and bonded wafers.
LiNbO3 on Si3N4 Bonded Wafers
Si3N4 bonded wafers are often used as a substrate for a variety of materials. Here are some examples of LiNbO3 on Si3N4 bonded wafers:
LiNbO3 on Si3N4 bonded wafer for acoustic wave devices: This type of wafer is used in surface acoustic wave (SAW) devices for applications such as mobile communications, wireless sensors, and electronic identification.
LiNbO3 on Si3N4 bonded wafer for optical waveguide devices: This type of wafer is used in waveguide devices for applications such as telecommunications, data communications, and optical sensing.
LiNbO3 on Si3N4 bonded wafer for microelectromechanical systems (MEMS): This type of wafer is used for the fabrication of MEMS devices, which are used in a variety of applications including sensors, actuators, and microfluidics.
LiNbO3 on Si3N4 bonded wafer for thin-film transistors (TFTs): This type of wafer is used in the fabrication of TFTs, which are used in flat-panel displays, touch screens, and other electronic devices.