Silicon carbide (SiC) on silicon nitride (Si3N4) bonded wafers are composite substrates that are commonly used in the semiconductor industry. The SiC layer provides a high thermal conductivity and a high electric field breakdown strength, while the Si3N4 layer provides good mechanical strength and chemical resistance. The SiC on Si3N4 bonded wafers are typically used in high-power and high-frequency applications such as power devices, LEDs, and RF devices. Some manufacturers of SiC on Si3N4 bonded wafers include Norstel, II-VI Incorporated, and SiCrystal.