Glass Substrates and Wafers

Glass substrates for semiconductor packaging

RF passive device design and manufacturing company that develops and builds novel, high-frequency 3D components

High-tech materials for specialty glass.

INPHOTEC makes available six technological platforms: Graphene Integrated Photonics, Silicon Photonics, Glass on Silicon, Hybrid Integration, LiNbO3 on Insulator (LNOI), Advanced Packaging.

Semiconductor wafer: Silicon, InP, GaAs, SiC, GaP. Infrared/Ultraviolet windows:Ge, ZnSe, Si, KBr, CaF2, MgF2, BaF2, LiF, Sapphire). Photoelectric substrate: SiO2, TiO2, LiNbO3, LiTaO3, PMN-PT. Strontium Titanate (SrTiO3) single crystal up to φ35mm.

Sputtered films on various substrates. Technical consulting on solar cells and vacuum and plasma process. Experimental substrate cutter, 4-point probe cable.

Chip heatsinks, glass products. Silicon, metal, sapphire and ceramic products for semiconductor.

Galss wafers and custom optical parts

Glass wafers (microstructured, packaging), phosphor-filled glass for LED (PiG), glass frit, microfluidic glass

Optical System / equipment: UV light sources, Laser Oscillators EO Glass: Color Glass Filters, Opto-Electronics Glass

Optical glass, glass ceramic, electronic glass, optics and precious metals.

Supplier of wafers and wafer services like thin film deposition, reclaim etc.

Manufacture specialty glass and ceramics, semiconductor manufacturing materials, wafer level optic solutions, analytical and measurement equipment.

Supplier if Silicon Wafers and substrates made from Fused Silica, Borofloat and other glasses, Sapphire and SOI wafers in small batch production.

Distributor of wafers.

Manufacturer of glass products for specific applications and advanced technology-driven industries.

Manufacturer of wafers for semiconductor, optics, MEMS and solar applications. Products include silicon, float zone, silicon on insulator and MEMS wafers. Customization options are also available.

Optical polishing services, CMP polishing, optical waveguide edge and optical angle polishing, wafer dicing and substrate dicing services, back grinding, flat lapping and CNC machining of all hard materials.

Custom manufacturer of wafers. Available up to 330 mm dia. with 0.20 mm thickness. Capabilities include planetary lapping, CNC shaping, dicing, slicing, machining, coating and polishing.