Silicon on Glass (SOG) Wafers are thin wafers that consist of a silicon layer deposited on a glass substrate. SOG wafers are commonly used in the fabrication of microelectronic devices, such as sensors and displays, due to their unique combination of electrical, thermal, and optical properties. The glass substrate provides mechanical stability and allows for easy handling, while the silicon layer provides electrical conductivity and the ability to process and integrate active electronic components. The thickness of the silicon layer can be tailored to meet specific application requirements. The fabrication process for SOG wafers involves depositing the silicon layer onto the glass substrate using various techniques, such as chemical vapor deposition (CVD) or plasma-enhanced CVD (PECVD). SOG wafers have several advantages, including a low cost, high thermal conductivity, and easy handling, making them an attractive choice for a wide range of microelectronic applications.