Asia Pacific Microsystems, Inc. has been dedicated to providing Micro Electro Mechanical Systems (MEMS) foundry service for over 15 years. Differentiating from IC foundries, MEMS foundry focuses on developing 3-dimentional microstructures and/or integrated optical, mechanical and electrical microchips. These include devices such as pressure and environmental sensors, silicon oscillators, optical actuators, silicon optical bench and micro fluidic structures. From the accumulated experience acquired in development and mass production of various MEMS devices, we are enabled to serve the numerous customers from different industries including consumer electronics, automotive, industrial, telecommunication, and biomedical sectors. In the future, APM plans to continue serving as a solution provider for customers in need of professional development and production of micromachined devices.
Technologies
With our complete MEMS advanced process modules as building blocks, multiple platforms have been built for the fabrication of MEMS devices on Si, Glass, SOI and cavity SOI substrates. These platforms expedite the fabrication iterations for customer's design validation and the product time-to-market. APM continues on deepening and widening its platform categories, and smooth the integration between them. Meanwhile, we tailor process flows in order to meet customer's special requirements.

 

Substrate Technology

Cavity SOI/SOG
Trench Isolation Technology
Layer Transfer Technology
Structured Glass and Glass Wafer Process
Thin Wafer Handling
 
Process Technology

DRIE Step Comb / Step Deep Etch 
Low Stress Membrane with Dimples
Nano Tip Process
Fine Pattern on 3D Structures
Nano Gap Process 
 

Wafer Level Encapsulation

SGS/GSG Sandwich Anodic Bonding 
Capping with Through Silicon Via, Through Glass Via
Capping with Lateral Feed Through and Special Dicing 
Eutectic Bonding for Hermetic Seal 
Low Temperature Adhesive Bonding  
 
Customized Manufacturing Platform

Various Pressure Sensor (>200,000,000 dies shipment)
Silicon Microphone (>80,000,000 dies shipment)
2D Micromirrors with Vertical Comb Actuator
Optical Bench and V-grooves
Micro Fluidic Component and Interposer

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