Semiconductor Manufacturing Electronics (ShaoXing) Corporation （SMEC）was founded in March 2018 with a registered capital of RMB 5.076 billion and headquartered in Shaoxing, Zhejiang province. SMEC provides foundry service focusing on technology solution for power, connection and sensor signal chain. On top of wafer foundry service, SMEC also extended its foundry service to module package in order to support semiconductor companies with one stop solution. SMEC provides complete manufacturing platform to support customer mass production as well as technology development.
SMEC offers global service. In addition to headquarter in Shaoxing, Zhejiang, SMEC has sales and marketing offices in Shanghai, Tokyo, and Switzerland. SMEC has established strategic cooperation with many customers. On the basis of mass production cooperation, SMEC continuously support customer with advanced technology development as well.
Provide customers with one-stop service from wafer manufacturing to power module packaging and testing, including IGBT module, MOSFET IPM module, DFN Cu clip and other system-level integrated packaging.
SMEC team has been working in the field of MEMS for more than ten years, and has rich experience in R&D and mass production. The technology mainly divided into two categories: one is opening device, such as microphone, pressure sensor, ultrasonic sensor and etc. ; the other is the sealed device, such as oscillator, accelerometer, gyroscope and etc.
SMEC has complete MEMS process platform, providing advanced technology, CMOS-MEMS single chip integration and wafer-level packaging service, which can provide customized process development and mass production solutions to customers.
MOSFET Technical Introduction
SMEC provides a complete MOSFET process platform, including trench MOSFET, split-gate MOSFET and super junction MOSFET, including advanced BGBM technology.
SMEC has complete MOSFET process platform and advanced technology. It can provide customized process development and mass production solutions for customers.
Based on field Stop IGBT structure, SMEC adopts advanced backside process technology, including backside thinning process, ion implantation, laser annealing and special metal deposition process. 600V~1200V process platform is already in mass production. SMEC provide specific FRD wafer foundry service as well.
Field Stop IGBT structure, advanced backside processing technology and flexible metal layer selection can provide customized process development and mass production solutions for customers.