Prototyping
Packaging support
Prototype as well as volume packaging with major assembly houses
Low-cost plastic packaging is offered in various types such as PQFP, QFN, BGA, etc.
For special cases, such as space applications, high quality ceramic packaging is offered
Testing, debugging & characterization, volume production support
Test software and test hardware (probe-card and load-board) can be developed
Prototypes debugged and characterized at different temperatures, frequencies and voltages
Data-logs of the measured parameters, histograms and CPK reports can be generated
After successful corner lots, volume risk production can start with yield monitoring and improvement
We support qualification procedures ranging from consumer, to industrial, medical and space applications according to the JEDEC standards

IC Manufacturing
Foundry Support
Dedicated foundry help-desk access
Access to foundry design rules, spice parameters, design kits, standard cell libraries
Assistance to customers in the optimal technology choice (speed, power, leakage, area, etc.) for customer’s future products through our Technology Targeting Service
Additional value-added services with major partners: training workshops, IP access, design & tape-out reviews, early technology insight, library re-characterization, IO ESD
We work with Small and Medium Enterprises (SMEs), helping our customers make their ASICs production-ready. Customers can choose to have more control by utilizing our Easy-COT service or opt for the ASIC services team to provide Full Turn Key (FTK) management of your project. We also support our customers with our technology targeting service to guide you in selecting the right technology for your design.

In addition, we collect the designs of customers – universities or private companies – on a single mask set to have them manufactured on a small volume of wafers. These multi-project wafer (MPW) runs allow sharing the expensive mask costs. Typically, we handle around 550 designs per year for MPW runs through the ASIC services team.

ASIC Design
Our design services give you access to our team of dedicated ASIC design specialists who are familiar with the design flow of deep sub-micron ICs and the EDA tools to perform this task. This team mainly focusses on the ASIC implementation steps after the architecture, or even after the RTL description or net list have been created.

We can help you with deep sub-micron design, overcoming common pitfalls that can cause your circuits to fail: clock-skew, latency of interacting clocks, IR-drop on the power mesh, electro-migration problems, interconnect delays, crosstalk, on-chip variation, the many metal interconnect layers, or low-power design methods. We also have an extensive program for radiation hardened platforms.

We have provided design services in processes from more than 10 different foundries. And this for both SoCs developed in-house and ASICs developed by our eco-system partners, companies, research institutes and universities. Many of these systems combine analog full-custom blocks with digital units including macros (e.g. RAM, ROM, …).

In addition, we have a team experienced in radiation-hardened designs. To that end, our specialists have developed libraries, building blocks and a design methodology as part of our DARE (Design Against Radiation Effects) platforms.

We also support our customers with our technology targeting service, guiding you in selecting the right technology for your design. Our in-house expertise is further enhanced by our local and international design and IP partner programs.

PCB/PBA design & manufacturing
As part of our aggregation services, we also offer consulting and tools for Printed Circuit Board (PCB) and Printed Board Assembly (PBA) design and manufacturing.

The center for Electronics Design and Manufacturing (cEDM):
Better Electronics at Reduced Cost through Science Based Methods.

The center’s goal is to support the industry in the development of high quality, reliable and cost-effective electronic assemblies by means of knowledge creation and sharing, scientifically sound methodologies and collaboration throughout the electronic supply chain.

Our core business: industrial and scientific knowledge on industrially available interconnection and component technologies, design, qualification, industrialization, manufacturing and operational reliability:

Component packaging
Electronic substrates
Electronic Assembly Technology & Reliability
Chip – Package – Board – System – Environment Interaction
Product and system integration
We offer 
Electronic assembly design-for-eXcellence guidelines: manufacturability, reliability, test, cost, etc.
Customer oriented training
Workshops that bring science to electronic product development
Development tools, checklists, calculators: for all aspects of electronic assembly design and manufacturing
Consultancy services like technology evaluation, hardware failure analysis, thermal and thermo-mechanical simulation etc.
Electronic substrate and assembly development and industrialization services
cEDM partner & member program providing easy access to science based Electronic Assembly development know-how and early involvement in product development improvement projects
The cEDM network provides ample opportunity for technical networking and collaboration, spanning the total electronic supply chain

Low power design
Extensive experience on low-power implementation techniques: multi-voltage domains, power shutdown, multiple threshold voltage levels.


The internet of things
Specialised in technologies and IP ideally suited to low-power, wireless, and secure products.


Photonic Integrated Circuits
Prototyping and small volume production of photonic integrated circuits implemented using standard silicon manufacturing processes.


Radiation hardened CMOS technology
Radiation-hardened ASIC building blocks implemented in standard foundry technologies.

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