Capcon Limited Co., Ltd

 , HK Manufacturer
Capcon provides innovative solutions like Flip-Chip Bonder, Chip-on-Wafer Bonder, Package-on-Package Bonder, Stack Die Bonder, Pannel-Level Die Bonder, Multi-Chip Die Bonder

Palomar Technologies, Inc

 , US Manufacturer
automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow processes.

Solution Advanced Technology Co.,Ltd.

 , KR Manufacturer
Display and semiconductor equipment.

Athlete FA Corporation

 , JP Manufacturer
Micro Ball Mounter, Flip Chip Bonder, Customized Machine, TAB/LCD System

All Ring Tech Co Ltd.

 , TW Manufacturer
Automation equipment for semiconductor, passive components and LED manufacturing process. Dispensers, Die and Wire Bonders, AOI and Measurement, Testers and Sorters.

JT Corp.

 , KR Manufacturer
Semiconductor equipment: Test Handler, Vision Inspection, Automation, Laser App. System, Flip Chip Handler, Die Attach System.

TDK Corporation

 , JP Manufacturer
Electronic components. Factory automation systems: FOUP Load Port, Flip Chip Bonding System

Shibuya Corporation

 , JP Manufacturer
Assembly/Hybrid Equipment: Flip Chip, Cleaning Equipment, Automation & Robotics, TAB Tools, Pick & Place, Marking Machines/Imprinting, Chip taping. FLAT PANEL DISPLAY (FPD): Tape Automated Bonding. Test: Handlers/Positioners.

SEC Co.,Ltd

 , KR Manufacturer
Industrial X-ray inspection system and SEM (Scanning Electron Microscope). Flip chip bonder, TAB IC potting system.

YoungTek Electronics Corp.

 , TW Manufacturer
IC tester, sorter, handler, AOI. Die bonders.

PFA Corporation

 , JP Manufacturer
Crystal oscillator manufacturing equipment, Camera module equipment, Pick Up assembly equipment, Flat Panel equipment, Other conveying and automatic assembly systems


 , JP Manufacturer
Wire Bonders, Die Bonders, Bump Bonders and Flip Chip Bonders

HiSOL, Inc

 , JP Manufacturer
Flip chip bonder, manual probers and accesoires. Laser decapsulation systems.

ASM AMICRA Microtechnologies GmbH

 , DE Manufacturer
Die Attach and Flip Chip Bonding, High Speed Wafer Inking and Inspection, High Speed Dispense System and Custom Solutions

Semiconductor Equipment Corporation, SEC

 , US Manufacturer,  Distributor
Dicing tapes, wafer mounters, die ejector, pick and place system, die matrix expander, die bonders, FOUP and cassette cleaners

Finetech GmbH & Co. KG

 , DE Manufacturer
Sub-micron and advanced die bonders.


 , SG Manufacturer
Automation machines and manufacturing solutions for Advanced Semiconductor Packaging and Smart Labels / RFIDs as well as for new developmental products such as Optoelectronics, MEMS, Photonics industries etc. Solder ball mounter,

SET Corporation SA

 , FR Manufacturer
Flip chip die bonder

BE Semiconductor Industries N.V., Besi

 , NL Manufacturer
Equipment for leadframe, substrate and wafer level packaging applications.