Flip Chip Bonder

Capcon provides innovative solutions like Flip-Chip Bonder, Chip-on-Wafer Bonder, Package-on-Package Bonder, Stack Die Bonder, Pannel-Level Die Bonder, Multi-Chip Die Bonder

automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow processes.

Display and semiconductor equipment.

Micro Ball Mounter, Flip Chip Bonder, Customized Machine, TAB/LCD System

Automation equipment for semiconductor, passive components and LED manufacturing process. Dispensers, Die and Wire Bonders, AOI and Measurement, Testers and Sorters.

Semiconductor equipment: Test Handler, Vision Inspection, Automation, Laser App. System, Flip Chip Handler, Die Attach System.

Electronic components. Factory automation systems: FOUP Load Port, Flip Chip Bonding System

Assembly/Hybrid Equipment: Flip Chip, Cleaning Equipment, Automation & Robotics, TAB Tools, Pick & Place, Marking Machines/Imprinting, Chip taping. FLAT PANEL DISPLAY (FPD): Tape Automated Bonding. Test: Handlers/Positioners.

Industrial X-ray inspection system and SEM (Scanning Electron Microscope). Flip chip bonder, TAB IC potting system.

IC tester, sorter, handler, AOI. Die bonders.

Crystal oscillator manufacturing equipment, Camera module equipment, Pick Up assembly equipment, Flat Panel equipment, Other conveying and automatic assembly systems

Wire Bonders, Die Bonders, Bump Bonders and Flip Chip Bonders

Flip chip bonder, manual probers and accesoires. Laser decapsulation systems.

Die Attach and Flip Chip Bonding, High Speed Wafer Inking and Inspection, High Speed Dispense System and Custom Solutions

Dicing tapes, wafer mounters, die ejector, pick and place system, die matrix expander, die bonders, FOUP and cassette cleaners

Sub-micron and advanced die bonders.

Automation machines and manufacturing solutions for Advanced Semiconductor Packaging and Smart Labels / RFIDs as well as for new developmental products such as Optoelectronics, MEMS, Photonics industries etc. Solder ball mounter,

Flip chip die bonder

Flip chip die bonder

Equipment for leadframe, substrate and wafer level packaging applications.