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Inner Lead Bonder

An Inner Lead Bonder (ILB) is a specialized machine used in the assembly of electronic packages. It is used to bond the inner leads of a device to the substrate, usually a printed circuit board (PCB). The ILB machine aligns the inner leads of the device with the bonding pads on the substrate and uses a combination of heat and pressure to create the bond. The bond is then checked to ensure that it meets the required electrical and mechanical specifications. There are several manufacturers of ILB machines, including K&S, Fineplacer, and Mirae, among others.

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Palomar Technologies, Inc

, US Manufacturer

automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow processes.

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YoungTek Electronics Corp.

, TW Manufacturer

IC tester, sorter, handler, AOI. Die bonders.

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Infotech AG

, CH Manufacturer, Custom Manufacturer

Solutions for power module production, die bonding and fluid dispensing. Semiconductor and optoelectronic packaging platforms and cell.

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