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Outer Lead Bonder

Outer Lead Bonder is a type of bonding equipment used in the assembly and packaging of microelectronics devices. It bonds the outer leads of a package to the printed circuit board (PCB) pads. This process helps to ensure the electrical connectivity and mechanical stability of the device. The outer lead bonder typically uses either thermosonic or thermo-compression bonding methods to bond the leads to the PCB pads. The bonder equipment is designed for high speed and high volume production, with advanced features for precise placement and alignment of the leads. The largest manufacturers of outer lead bonders include K&S, Palomar Technologies, and Europlacer.

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Palomar Technologies, Inc

, US Manufacturer

automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow processes.

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Solution Advanced Technology Co.,Ltd.

, KR Manufacturer

Display and semiconductor equipment.

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Guangzhou Minder-Hightech Co.,ltd

, CN Manufacturer

Wire bonders, soldering and dispencing robots, welding machines. LCD repair equipment. Environment testing equipment.

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Infotech AG

, CH Manufacturer, Custom Manufacturer

Solutions for power module production, die bonding and fluid dispensing. Semiconductor and optoelectronic packaging platforms and cell.

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