CRESSEM Ltd

 , KR Manufacturer
AI Vision Inspection, Ultrasonic ACF Bonding

Athlete FA Corporation

 , JP Manufacturer
Micro Ball Mounter, Flip Chip Bonder, Customized Machine, TAB/LCD System

All Ring Tech Co Ltd.

 , TW Manufacturer
Automation equipment for semiconductor, passive components and LED manufacturing process. Dispensers, Die and Wire Bonders, AOI and Measurement, Testers and Sorters.

Shibaura Mechatronics Corp.

 , JP Manufacturer
Equipment for flat-panel displays, semiconductors and optical film sputtering equipment, and of vacuum equipment and laser equipment.

BE Semiconductor Industries N.V., Besi

 , NL Manufacturer
Equipment for leadframe, substrate and wafer level packaging applications.

KULICKE AND SOFFA INDUSTRIES, INC

 , SG Manufacturer
Bonders, WLP packaging solutions

AP Tech

 , KR Manufacturer
Manufacturer of assembly and test equipment for semiconductor, LED, FPD, camera module.