JFP MICROTECHNIC
, FR Manufacturer
Die Bonder | Wire Bonder | Scriber | Laser tester/stacker | Rework station | Inspection Camera |
adwelds corporation
, JP Manufacturer
Manufacturing machines for: Power device, Semiconductor, Electronic Components, Flat Panel Display, Plastics, Automotive, Medical appliance and other peripheral equipment, devices, and machines. Design, Maintenance, Instalment, and Sales
Ultrasonic Engineering Co., Ltd
, JP Manufacturer
Ultrasonic wire bonder, ultrasonic metal welding machine, ultrasonic plastic welder, ultrasonic cleaner, ultrasonic measuring instrument
Seen BnTek Co., Ltd.
, KR Manufacturer
Semiconductor equipment and mobile phone manufacturing automation systems, robots for factory automation, equipment
Eco-Tech Microelectronics Ltd
, RU Manufacturer, Custom Manufacturer
Die bonder, wire bonder, die attach tester, wire pull tester, ultrasound generator.
JSC NIITOP
, RU Manufacturer
Photoresist coating and developing machines, die bonder, wire bonder, DI water equipment, dicing film laminator, dicing saw, wafer expander, UV film curing,
Samil Tech Co., Ltd
, KR Manufacturer
trim/form equipment, semiconductor package inspection equipment, laser deflash equipment, and laser marking equipment among semiconductor post-processing equipment.
Palomar Technologies, Inc
, US Manufacturer
automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow processes.
ficonTEC Service GmbH
, DE Manufacturer, Custom Manufacturer
automated assembly and testing systems for high-end photonic components, devices and PICs (photonics integrated circuits).
Kaijo Corporation, Kaijo
, JP Manufacturer
Semiconductor assembly equipment (Wire/Stud bump bonding machine, Die bonding machine), Ultrasonic cleaning systems.
Shibuya Corporation
, JP Manufacturer
Assembly/Hybrid Equipment: Flip Chip, Cleaning Equipment, Automation & Robotics, TAB Tools, Pick & Place, Marking Machines/Imprinting, Chip taping. FLAT PANEL DISPLAY (FPD): Tape Automated Bonding. Test: Handlers/Positioners.
Shenzhen Xinkong Semiconductor Technology Co.,Ltd
, CN Manufacturer
Soft solder die bonder, wire bonder
TPT Wire Bonder GmbH & Co. KG
, DE Manufacturer
Die Bonders and Wire Bonders.
SHINKAWA LTD
, JP Manufacturer
Wire Bonders, Die Bonders, Bump Bonders and Flip Chip Bonders
Hesse GmbH
, DE Manufacturer
Ultrasonic bonding and welding machines
F&S BONDTEC Semiconductor GmbH
, AT Manufacturer
Wire bonders, bond testers.
F&K DELVOTEC Bondtechnik GmbH
, DE Manufacturer
Wire bonders. Laser bonders for Al and Cu ribbon bonding to DBC substrates.
Micro Point Pro LTD.
, IL Manufacturer
Die and wire bonding tools, fluid and solder dispencing tools, manual die bonders, 4-point probes.
Guangzhou Minder-Hightech Co.,ltd
, CN Manufacturer
Wire bonders, soldering and dispencing robots, welding machines. LCD repair equipment. Environment testing equipment.
KULICKE AND SOFFA INDUSTRIES, INC
, SG Manufacturer
Bonders, WLP packaging solutions