Wire Bonder

Ultrasonic wire bonder, ultrasonic metal welding machine, ultrasonic plastic welder, ultrasonic cleaner, ultrasonic measuring instrument

Semiconductor equipment and mobile phone manufacturing automation systems, robots for factory automation, equipment

Die bonder, wire bonder, die attach tester, wire pull tester, ultrasound generator.

Photoresist coating and developing machines, die bonder, wire bonder, DI water equipment, dicing film laminator, dicing saw, wafer expander, UV film curing,

trim/form equipment, semiconductor package inspection equipment, laser deflash equipment, and laser marking equipment among semiconductor post-processing equipment.

automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow processes.

automated assembly and testing systems for high-end photonic components, devices and PICs (photonics integrated circuits).

Semiconductor assembly equipment (Wire/Stud bump bonding machine, Die bonding machine), Ultrasonic cleaning systems.

Assembly/Hybrid Equipment: Flip Chip, Cleaning Equipment, Automation & Robotics, TAB Tools, Pick & Place, Marking Machines/Imprinting, Chip taping. FLAT PANEL DISPLAY (FPD): Tape Automated Bonding. Test: Handlers/Positioners.

Soft solder die bonder, wire bonder

Die Bonders and Wire Bonders.

Wire Bonders, Die Bonders, Bump Bonders and Flip Chip Bonders

Ultrasonic bonding and welding machines

Wire bonders, bond testers.

Wire bonders. Laser bonders for Al and Cu ribbon bonding to DBC substrates.

Die and wire bonding tools, fluid and solder dispencing tools, manual die bonders, 4-point probes.

Wire bonders, soldering and dispencing robots, welding machines. LCD repair equipment. Environment testing equipment.

Bonders, WLP packaging solutions

Integrated solutions provider in semiconductor and electronics industries with two business segments - Semiconductor Solutions Segment and SMT Solutions with leading market positions.

Die Sorter, Die Bonder, Ultrasonic Wire Bonder, Dispensing Systems and Inspection Systems for packaging of Integrated Circuits and Chip-on-Board products.