Cleaning and Washing Equipment for Assembly and Packaging

Steam two-fluid cleaning systems, highly concentrated ozone water cleaning equipment.

Semiconductor: FOUP Cleaner, POD Cleaner, Wet Station, Chemical Delivery Supply System, Metal Lift Off, Cassette & Magazine Cleaner. Display: OLED Mask Cleaner, Glass Cleaner, Etcher & Stripper, Auto Macro Inspection, Stream-Jet Printing, Lamination M/C,

Wet Station, Ultrasonic Cleaner, Tube Cleaner and Parts Cleaner for semiconductor and FPD production parts cleaning equipment. Chemical Supply System

Central Chemical Supply System / Wet System / Inkjet Printing System for semiconductor and display

Wafer box, wafer carrier, wafer cassette, wafer carrier handle, RSP (reticle SMIF pod), RSP opener, mask case, chip tray, fluoro valves, cleanroom supplies, wafer and cassette cleaning systems

Press welding heads (titanium, molybdenum, copper, ceramics, etc.), semi-automatic hot press, fully automatic hot press, pulse system modules, platform fixtures, semiconductor equipment and other related products.

Wet Cleaning Systems and Chemicals, UV Ozone Cleaner, Wafer Mounter, Wafer Expander, Grip Ring, UV Curing System

Fully automated, semi-automated and manual wet benches, fume hoods, plating systems, bulk chemical delivery systems. Key Products: Semiconductor equipment - PV manufacturing equipment, PV module manufacturing equipment, thin film manufacturing equipment

Megasonic systems for advanced wet process technology markets

Auto wafer mounters, taping, laminator & presses, expanders, UV irradiators, breakers, grinding machines, lapping machines, polishing machines, and other tailor-made equipment in the LED, semiconductor, optical communication (5G)

Trim/Form/Singulation Machine. Taping and tray packing machine. Connector assembly machine. Pin insert machine.

Semiconductor Equipment, OVEN, CHAMBER, LED Equipment, LCD Equipment, Connector Tool, Insert Machine, Automobile Part Test Equipment.

trim/form equipment, semiconductor package inspection equipment, laser deflash equipment, and laser marking equipment among semiconductor post-processing equipment.

Solder Ball Attach, Marking System, Laser Drilling, PKG Stack System, Package Laser Saw System, Flux Pre-Cleaning System, Substrate Merge & Sorting System, Loader & Offloader System, Router System, Solder Ball Attach Tool Kit, Pick & Place System

Mask Aligner, Total Lithography Solution, Spin Coater System, Mask Spin Cleaning System, Wet Station System, Exposure System, Glass Scribing Machine

NEMS develops plasma technologies and provides plasma surface treatment solutions, including vacuum and atmospheric plasma machines. NEMS plasma machines can be used for surface cleaning surface etching and surface modification

Semiconductor assembly equipment (Wire/Stud bump bonding machine, Die bonding machine), Ultrasonic cleaning systems.

Cleaning solutions for wafer back end, flip-chip, wire bonding cleaning.

MPM stencil printing equipment for electronic materials; Camalot Systems fluid dispensers; Electrovert reflow soldering, wave soldering, and curing, and cleaning equipment; Vitronics Soltec selective soldering, reflow and wave soldering equipment.

Automation solutions for microelectronics. Taping, Measuring System, Laser Marker, Winding Machine, Autom. Cutting Machine, Testing and Taping Machine, Reloading Machine, IT Tester, Testing Station, Capacity Stacker, Bar Welding Machine.