Solder Ball Mounter

Solder Ball Attach, Marking System, Laser Drilling, PKG Stack System, Package Laser Saw System, Flux Pre-Cleaning System, Substrate Merge & Sorting System, Loader & Offloader System, Router System, Solder Ball Attach Tool Kit, Pick & Place System

Micro Ball Mounter, Flip Chip Bonder, Customized Machine, TAB/LCD System

Semiconductor assembly equipment (Wire/Stud bump bonding machine, Die bonding machine), Ultrasonic cleaning systems.

Assembly/Hybrid Equipment: Flip Chip, Cleaning Equipment, Automation & Robotics, TAB Tools, Pick & Place, Marking Machines/Imprinting, Chip taping. FLAT PANEL DISPLAY (FPD): Tape Automated Bonding. Test: Handlers/Positioners.

Thin Film Forming Equipment. Solder ball mounters. FPD (Flat Panel Display) equipment. RGB Ink-Jet Printing System.

Dicing saw, singulation jig saw, cleaner, ball mounter tool, test tools and software.

Solder ball bumping equipment, sintering systems

Automation machines and manufacturing solutions for Advanced Semiconductor Packaging and Smart Labels / RFIDs as well as for new developmental products such as Optoelectronics, MEMS, Photonics industries etc. Solder ball mounter,

Solder ball placement system, camera module assembly system, semiconductor process automation equipment, package sorting and packing equipment.

FPD manufacturing equipment. Wafer mounter, wafer cleaning machines, die bonders. Laser cutting, marking and solder ball welding machines.

Manufacturer of solder balls and solder ball mounting equipment.

State-of-the-art automated equipment to the Wafer Level Packaging and Backend Industries.