Trim & Forming Equipment

Photolithography equipment, Photomask making equipment, Chemistry equipment, Washing and drying equipment for wafers and substrates, Vacuum and plasma equipment, Control, Testing and Measuriung equipment, Solar cell test equipment, Local clean zones.

BEOL semiconductor equipment: laser marking, wafer inspection, wafer jet deflashing systems, tape and reel machines. Test handlers, pick and place inspection, trim/sort machines,

Precision IC mold and die

Molding equipment, Trim & foam equipment, Automatic tape sticking, Peeling device, Composite mold equipment, Insert molding equipment, Automatic assembly machine

Backend Semicon Equipment: Saw and Place, Pick and Place, L/F loader, Trim/Form/Singulation, Strip/Wafer Mount System, Wafer Taping/Detaping System, Cam Press Trim/Form System. Vision Inspection Systems, Inline Assy System, Ultrasonic Welding System.

Auto Trim System Auto Form/ Singulation System Side View LED Trim / Form / Singulation System. LCD Glass Inspection System. Vision cropping. Ceramic reflector Sculpture system LED Trim / Form / Singulation System. LED Strip Cutting System. Connector asse

Semiconductor Equipment, OVEN, CHAMBER, LED Equipment, LCD Equipment, Connector Tool, Insert Machine, Automobile Part Test Equipment.

Semiconductor Assembly equipment, Sapphire Wafer Process Equipment, Precision mold & die parts manufacturing

trim/form equipment, semiconductor package inspection equipment, laser deflash equipment, and laser marking equipment among semiconductor post-processing equipment.

Semiconductor equipment and ultra-precision automation equipment. Automatic trim, form, load, unload equipment for packaging. Precision mechanical parts

Lead frames, TO- headers, ceramic packages, stamping and molding dies, press mold equipment.

Solder Ball Attach, Marking System, Laser Drilling, PKG Stack System, Package Laser Saw System, Flux Pre-Cleaning System, Substrate Merge & Sorting System, Loader & Offloader System, Router System, Solder Ball Attach Tool Kit, Pick & Place System

Trim and form system

Automation solutions for microelectronics. Taping, Measuring System, Laser Marker, Winding Machine, Autom. Cutting Machine, Testing and Taping Machine, Reloading Machine, IT Tester, Testing Station, Capacity Stacker, Bar Welding Machine.

Molding Systems, Handlers, trim and Form Systems, Stamping and T/F die set.

Lead trim and form tools. SMT manufacturing equipment

Semiconductor packaging equipment: WLP marking, film frame mounting, spin coater system. Laser marking, test tape and reel, trim/form and lamination, pick and place, AOI systems. PV cell scribing, singulaition, and stringing system. LED dispensing system.

Equipment for leadframe, substrate and wafer level packaging applications.

Molding and singulation equipment for semiconductor packaging.