Die Sorter

LED/OLED Equipment: Wireless logistics, Micro LED Chip AOI Inspector, Dispenser, PAD Cleaner, COG FOG AOI. Semiconductor: Mount Inspector, Wire Bonding, Die Attach, Wafer Warpage, WRS Inspector, STOCKER system, Wafer Edge, Macro Tower Lifter, STB, Rail.

automatic vision inspection that is dedicated to Semicon backend front of line operations. We have the world's first 3D inspection running in mass production.

Semiconductor equipment: Test Handler, Vision Inspection, Automation, Laser App. System, Flip Chip Handler, Die Attach System.

Assembly/Hybrid Equipment: Flip Chip, Cleaning Equipment, Automation & Robotics, TAB Tools, Pick & Place, Marking Machines/Imprinting, Chip taping. FLAT PANEL DISPLAY (FPD): Tape Automated Bonding. Test: Handlers/Positioners.

Equipment for cleaning , photo track, and etcher. Prober, test, handler, sorter equipment.

Pick and Place, Die attach equipment.

Crystal oscillator manufacturing equipment, Camera module equipment, Pick Up assembly equipment, Flat Panel equipment, Other conveying and automatic assembly systems

LED equipment: LED Prober, Sorter, Die Transfer, Taping Machine, Phosphor Coater, CSP Blade Cutter, Dispenser. FPD Equipment: Laser Lift-Off, Laser Cutting System, Prober. Laser scribing and marking. Die (chip) transfer systems.

Discrete Test System, Thermal Resistance Tester, Inductive Load Tester, Dynamic Test System, IPD/IPM Test System, Internal Gate Resistance Tester, MEMS Handler, Film Frame Test Handler, Die Sorter, Gravity Handler, TAB Handler

Wafer-Level Chip Scale Packaging Inspection & Sort, Integrated Tray-based Scan-Pack, High Speed Tray Taping Machine, Turret-based Scan-Pack Wafer Inspection Machine

Probe cards and systems. Photonics probers, testers, sorters and AOI. Temperature cycling test systems.

Bond testers and die sorters

FOUP and cassette cleaning systems manufacturer. Ionizers, ESD removal bar, ultrasonic wafer and substrate cleaner, wafer and reticle cleaning systems,

Clean Room: Static Control, Storage Units, Cleaning Equipment. Process Equipment: Wet Etch Systems, Diffusion/Oxidation/Annealing, Developing.

Manufacturer of assembly and test equipment for semiconductor, LED, FPD, camera module.

Die Sorter, Die Bonder, Ultrasonic Wire Bonder, Dispensing Systems and Inspection Systems for packaging of Integrated Circuits and Chip-on-Board products.