Lead Inspector

BEOL semiconductor equipment: laser marking, wafer inspection, wafer jet deflashing systems, tape and reel machines. Test handlers, pick and place inspection, trim/sort machines,

Dicing saws, Ball, Bump, Burr AOI

Backend Semicon Equipment: Saw and Place, Pick and Place, L/F loader, Trim/Form/Singulation, Strip/Wafer Mount System, Wafer Taping/Detaping System, Cam Press Trim/Form System. Vision Inspection Systems, Inline Assy System, Ultrasonic Welding System.

automatic vision inspection that is dedicated to Semicon backend front of line operations. We have the world's first 3D inspection running in mass production.

IC chip test handler, wafer and reel AOI, CMP pad metrology in-situ monitor. Glass gringing, chmfering machine for FPD, automatic edge coating sysyem for FPD.

AOI for Back- End Semiconductor: Vision Inspection System, Post Seal Vision Handler, Tray-based Vision Handler, Wafer Vision Inspection Handler

AOI (Automatic Optical Inspection) equipment for FPD and semiconductor products.

Crystal oscillator manufacturing equipment, Camera module equipment, Pick Up assembly equipment, Flat Panel equipment, Other conveying and automatic assembly systems

Wafer, Reticle and Package Inspection Systems. Lasrer Marking Systems. Auto Scope System.

Auto Guided Vehicles (AGV), L/F inspection machine, laser marking system, dispence system, post mold cure system, rotary test handler, tube to tray handler, tube-to-tube test handler.

Wafer-Level Chip Scale Packaging Inspection & Sort, Integrated Tray-based Scan-Pack, High Speed Tray Taping Machine, Turret-based Scan-Pack Wafer Inspection Machine

Vison Inspection System, Wafer Measurement System, Wafer Handling System

Automati optical inspection equipment (AOI) for packaged electronic components and carrier tape.